EP2AGX95EF35I3 vs EP2AGX95EF35C6G Perbandingan
Perbandingan bersamaan detil EP2AGX95EF35I3 dari Intel dan EP2AGX95EF35C6G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGX95EF35I3 | EP2AGX95EF35C6G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GX | — |
| Logic Elements | 89,178 | 89,178 |
| Embedded Memory Bits | 6,839,296 | — |
| User I/O Count | 452 | — |
| Paket | 1152-ball FCBGA | 1152-BBGA, FCBGA |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | [DATA_NEEDED: core voltage] |
| Operating Frequency (max) | 500 MHz | — |
| Temperature Grade | Industrial (I3) | — |
| Junction Temperature | -40 °C to +100 °C | — |
| Transceivers | Up to 16 (6.375 Gbps) | — |
| DSP Blocks | 18x18 multipliers | — |
| External Memory Support | DDR2/DDR3 | — |
| Tipe Mounting | Surface Mount (BGA) | — |
| Status RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Product Family | — | Arria II GX |
| Embedded Memory | — | 6,839,296 bits |
| User I/O | — | 452 |
| Package Type | — | Ball Grid Array |
| Manufacturer | — | Altera / Intel |
| Suhu Kerja | — | [DATA_NEEDED: operating temperature] |
| Frekuensi Bawah Maximum | — | [DATA_NEEDED: maximum clock frequency] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Transceiver Data Rate | — | [DATA_NEEDED: transceiver data rate] |
| Power Dissipation | — | [DATA_NEEDED: power dissipation] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| Ball Pitch | — | [DATA_NEEDED: ball pitch] |
| REACH Status | — | [DATA_NEEDED: REACH status] |