EP2AGX95EF35I3G vs EP2AGX95EF35C6G Perbandingan
Perbandingan bersamaan detil EP2AGX95EF35I3G dari Intel dan EP2AGX95EF35C6G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGX95EF35I3G | EP2AGX95EF35C6G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria II GX | — |
| Logic Elements | 89,178 | 89,178 |
| Total RAM Bits | 6,839,296 | — |
| Number of LABs/CLBs | 452 | — |
| User I/O Count | 452 | — |
| Paket | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA |
| Tipe Mounting | Surface Mount | — |
| Suhu Kerja | -40C to +100C (Industrial) | [DATA_NEEDED: operating temperature] |
| Tegangan Pemuat | 0.9 V core, 1.1 V/1.2 V/1.5 V/1.8 V/2.5 V/3.0 V I/O | — |
| Transceiver Count | Up to 12 channels | [DATA_NEEDED: transceiver count] |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| DSP Blocks | 484 (18x18 multipliers) | — |
| Embedded Hard IP | PCI Express Gen1/Gen2 endpoint/root-port | — |
| Memory Interfaces | DDR3 SDRAM up to 800 Mbps, DDR2, QDR II+ | — |
| Process Technology | 40 nm TSMC | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Level MSL | [DATA_NEEDED: MSL rating] | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Product Family | — | Arria II GX |
| Embedded Memory | — | 6,839,296 bits |
| User I/O | — | 452 |
| Package Type | — | Ball Grid Array |
| Manufacturer | — | Altera / Intel |
| Core Voltage | — | [DATA_NEEDED: core voltage] |
| Frekuensi Bawah Maximum | — | [DATA_NEEDED: maximum clock frequency] |
| Transceiver Data Rate | — | [DATA_NEEDED: transceiver data rate] |
| Power Dissipation | — | [DATA_NEEDED: power dissipation] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| Ball Pitch | — | [DATA_NEEDED: ball pitch] |
| REACH Status | — | [DATA_NEEDED: REACH status] |