EP2S180F1508C4TT vs EP2S180F1508C3N Perbandingan
Perbandingan bersamaan detil EP2S180F1508C4TT dari Altera dan EP2S180F1508C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Altera
EP2S180F1508C4TT - 180K Logic Elements FPGA | Altera | High-Performance Digital Logic
EP2S180F1508C4TT Obsolete
Perbandingan Spesifikasi
| Parameter Umum | EP2S180F1508C4TT | EP2S180F1508C3N |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Product Type | Field-Programmable Gate Array (FPGA) | — |
| Device Family | Stratix II | — |
| Logic Elements | approximately 180,000 | — |
| User I/O | 1,170 pins | — |
| Logic Array Blocks | 8,970 LABs | — |
| Paket | 1,508-ball FBGA | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Temperature Grade | -T | — |
| Configuration Mechanism | [DATA_NEEDED: configuration mechanism] | — |
| Operating Voltage | [DATA_NEEDED: operating voltage] | — |
| Core Voltage | [DATA_NEEDED: core voltage] | — |
| I/O Voltage | [DATA_NEEDED: I/O voltage] | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature] | — |
| Storage Temperature | [DATA_NEEDED: storage temperature] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | 40 mm x 40 mm |
| Ball Pitch | [DATA_NEEDED: ball pitch] | — |
| Typical Power Dissipation | [DATA_NEEDED: typical power dissipation] | — |
| Status RoHS | unknown | — |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Lead-Free Status | unknown | — |
| Halogen-Free Status | unknown | — |
| Series | — | Stratix II |
| Family | — | FPGA - Field Programmable Gate Array |
| Manufacturer | — | Intel (formerly Altera) |
| Equivalent Logic Elements | — | 179,400 |
| Logic Array Blocks (LABs) | — | 8,970 |
| Total RAM Bits | — | 9,383,040 |
| User I/Os | — | 1,170 |
| DSP Blocks | — | 96 |
| Supply Voltage (Core) | — | 1.15 V to 1.25 V |
| Process Technology | — | 90 nm CMOS, all-layer copper |
| Package Type | — | 1508-BBGA, FCBGA |
| Operating Temperature Grade | — | Commercial |
| Speed Grade | — | C3 |
| Lead Free / RoHS | — | Not specified in source data |