EP2SGX60EF1152C3N vs EP2SGX60EF1152C4 Perbandingan
Perbandingan bersamaan detil EP2SGX60EF1152C3N dari Intel dan EP2SGX60EF1152C4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2SGX60EF1152C4 - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
EP2SGX60EF1152C4 ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP2SGX60EF1152C3N | EP2SGX60EF1152C4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Waktu Pembelian Terakhir |
| Family | Stratix II GX | — |
| Series | Stratix II | — |
| Logic Elements | 60,440 | — |
| Adaptive Logic Modules (ALMs) | 30,220 | — |
| Logic Array Blocks (LABs) | 3022 | — |
| Embedded Memory (bits) | 2,544,192 | — |
| Maximum User I/Os | 534 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage (Vcc) | 1.2 V | — |
| Maximum Internal Frequency | 717 MHz | — |
| Propagation Delay | 0.40 ns | [DATA_NEEDED: propagation delay exact value] |
| Embedded Multipliers (18x18) | [DATA_NEEDED: embedded multiplier count] | — |
| PLLs | 4 | — |
| Transceiver Data Rate | 3.125 Gbps per channel | — |
| Paket | 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch | — |
| Speed Grade | C3 (commercial, -3 bin) | C4 (commercial) |
| Suhu Kerja | 0C to +85C (commercial) | 0C to 85C (commercial) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Device Family | — | Stratix II GX |
| Logic Elements (LE) | — | 60,440 |
| Logic Array Blocks / CLBs | — | 3022 |
| Total RAM Bits | — | 2,544,192 |
| User I/O Pins | — | 534 |
| Number of LABs/CLBs | — | 3022 |
| Package Type | — | 1152-BBGA, FC-FBGA |
| Package Pitch | — | 1.0 mm |
| Core Voltage | — | 1.15 V to 1.25 V |
| Internal Frequency | — | 717 MHz (max) |
| Status RoHS | — | Compliant |
| Lead-Free | — | Yes |