EP3C55F484I7N vs EP3C55U484C6N Perbandingan
Perbandingan bersamaan detil EP3C55F484I7N dari Altera dan EP3C55U484C6N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C55F484I7N | EP3C55U484C6N |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Family | Cyclone III | — |
| Logic Elements | 55,856 | 55856 LE |
| Logic Array Blocks (LABs) | 3,491 | — |
| Total RAM Bits | 2,396,160 (some listings cite 2,491,520) | — |
| Embedded Memory Blocks (M9K) | 312 | — |
| Embedded 18-bit Multipliers | 156 | — |
| PLLs | 4 | — |
| Maximum User I/Os | 327 | — |
| User I/O Banks | 8 | — |
| Core Voltage | 1.2 V | — |
| Rentang Suhu Kerja | -40 C to +100 C (Industrial) | — |
| Speed Grade | 7 | — |
| Internal Clock Frequency | up to 472.5 MHz | — |
| Paket | 484-pin FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch | 484-FBGA |
| Process Technology | 65 nm CMOS, low power | 65 nm |
| Status RoHS | Compliant (Lead-free) | Compliant |
| Configuration Modes | JTAG, Active Serial, Passive Serial | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Family | — | Cyclone III |
| Number of Logic Cells | — | 55856 cells |
| Embedded Memory | — | 2396160 bit |
| I/O Count | — | 327 I/O |
| Core Technology Voltage | — | 1.2 V |
| JTAG LVTTL/LVCMOS Operation | — | 3.3 V, 3.0 V, 2.5 V |
| Package Code | — | FBGA |
| Terminal Count | — | 484 |
| Terminal Form | — | Ball |
| Tipe Mounting | — | Surface Mount |
| Clock Rate | — | 437.5 MHz |
| REACH Status | — | unknown |
| Automotive Qualification | — | unknown |
| Lead-Free Status | — | unknown |
| Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| Maximum I/O Voltage | — | [DATA_NEEDED: maximum I/O voltage] |
| Tahanan Panas | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |