EP3C55U484C6N vs EP3C55F484C7N Perbandingan
Perbandingan bersamaan detil EP3C55U484C6N dari Intel dan EP3C55F484C7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C55U484C6N | EP3C55F484C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 55856 LE | 55,856 |
| Number of Logic Cells | 55856 cells | — |
| Embedded Memory | 2396160 bit | — |
| I/O Count | 327 I/O | — |
| Core Technology Voltage | 1.2 V | — |
| Process Technology | 65 nm | 60 nm TSMC low-power |
| JTAG LVTTL/LVCMOS Operation | 3.3 V, 3.0 V, 2.5 V | — |
| Paket | 484-FBGA | 484-FBGA (FineLine BGA) |
| Package Code | FBGA | — |
| Terminal Count | 484 | — |
| Terminal Form | Ball | — |
| Tipe Mounting | Surface Mount | — |
| Clock Rate | 437.5 MHz | — |
| Status RoHS | Compliant | Compliant |
| REACH Status | unknown | — |
| Automotive Qualification | unknown | — |
| Lead-Free Status | unknown | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | 0C to 85C (Commercial) |
| Configuration Interface | [DATA_NEEDED: configuration interface] | — |
| Maximum I/O Voltage | [DATA_NEEDED: maximum I/O voltage] | — |
| Tahanan Panas | [DATA_NEEDED: junction-to-ambient thermal resistance] | — |
| Embedded Memory (bits) | — | 2,396,160 |
| Maximum User I/O | — | 327 |
| Number of LABs/CLBs | — | 3,491 |
| Embedded Multipliers (18x18) | — | 156 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Speed Grade | — | 7 |
| Configuration Modes | — | JTAG, AS, AP, PS |
| Encryption | — | AES-256 |
| Tegangan Pemuat | — | 1.2 V core (VCCINT) |