EP3C55U484C7 vs EP3C55U484C8N Perbandingan
Perbandingan bersamaan detil EP3C55U484C7 dari Intel dan EP3C55U484C8N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C55U484C7 | EP3C55U484C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,488 | — |
| Embedded Memory (bits) | 2,396,160 | 2,396,160 |
| Embedded Multipliers (18x18) | 156 | — |
| Maximum User I/O Pins | 327 | — |
| Number of PLLs | 4 | — |
| Maximum Operating Frequency | 437 MHz | — |
| Process Technology | 65 nm CMOS | 60 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltages | 1.2 V / 2.5 V / 3.0 V / 3.3 V | — |
| Paket | 484-ball UBGA (Ultra-FineLine BGA) | 484-UBGA (Ultra FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Package Dimensions | 19 x 19 mm | — |
| Ball Pitch | 0.80 mm | — |
| Speed Grade | C7 (Commercial) | 8 (commercial, fastest) |
| Suhu Kerja | 0C to +85C (Commercial) | 0 C to +85 C (commercial) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | — |
| Family | — | EP3C55 |
| Logic Elements | — | 55,856 |
| Number of Logic Array Blocks (LABs) | — | 3,491 |
| Number of M9K Memory Blocks | — | 250 |
| Embedded 18x18 Multipliers | — | 156 |
| Phase-Locked Loops (PLLs) | — | 4 |
| Maximum User I/Os | — | 327 |
| Number of I/O Banks | — | 8 |
| Lead-Free / RoHS | — | Compliant (per DigiKey listing) |