EP3C80F780C6N vs EP3C80F780I7N Perbandingan
Perbandingan bersamaan detil EP3C80F780C6N dari Intel dan EP3C80F780I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C80F780C6N | EP3C80F780I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III | Cyclone III |
| Logic Elements (LE) | 81,264 | 81,264 |
| Embedded Memory Bits | 2,810,880 bits | — |
| Embedded Memory (Mbits) | 4 Mbits | — |
| Embedded 18x18 Multipliers | 281 | — |
| PLLs | 4 | 4 |
| Maximum User I/O | 429 | — |
| I/O Banks | 8 | — |
| Process Technology | 65 nm low-power CMOS | — |
| Core Voltage | 1.2 V | 1.2 V |
| Maximum Operating Frequency | 500 MHz | — |
| Paket | 780-ball FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch | 780-FBGA (29 x 29 mm, 1 mm pitch) |
| Operating Temperature (Commercial) | 0 C to +85 C | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (lead-free, per AmpHeo listing) | — |
| Total Memory Bits | — | 2,810,880 bits |
| Maximum User I/Os | — | 429 |
| Global Clock Networks | — | 20 |
| Internal Maximum Frequency | — | 472 MHz |
| Process Node | — | 60 nm low-power |
| Suhu Kerja | — | -40C to +100C (Industrial) |
| Status RoHS | — | Compliant |
| Lead-Free | — | Yes |
| Level MSL | — | 3 (168 hours) |