EP3CLS100F484C8N vs EP3CLS150F484C8N Perbandingan
Perbandingan bersamaan detil EP3CLS100F484C8N dari Intel dan EP3CLS150F484C8N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3CLS100F484C8N | EP3CLS150F484C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone® III LS | — |
| Family Name | Cyclone III LS | — |
| Logic Elements | 100,448 | — |
| Embedded Memory Bits | 4,451,328 bits | — |
| Number of I/O | 278 (maximum user I/O) | — |
| Number of Logic Blocks / Cells | 47 (logic blocks reported by DigChip snapshot) | — |
| Package Type | FBGA-484 (FineLine BGA, lead-free) | — |
| Pin / Ball Count | 484 | — |
| Supply Voltage (Core) | 1.2 V | — |
| Speed Grade | C8 (commercial, fastest) | 8 (commercial) |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm low-power |
| Suhu Kerja | 0°C to +85°C (commercial grade) | 0C to +85C (commercial) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Configuration Interface | JTAG, Passive Serial, Active Serial | — |
| Bitstream Encryption | AES-128 (Cyclone III LS security feature) | — |
| Status RoHS | Compliant (Pb-free, 'N' suffix) | Compliant |
| Level MSL | 3 (per JEDEC J-STD-020, typical for BGA) | — |
| Embedded Multipliers (18x18) | 4,488 (per Cyclone III LS family handbook, 100K LE tier) | 210 |
| PLLs | 4 (per Cyclone III LS family) | 4 |
| DSP Blocks | Integrated (multiplier-based) | — |
| Family | — | Cyclone III LS |
| Logic Elements (LE) | — | 150,848 |
| Total RAM Bits | — | 6,137,856 bits |
| Logic Array Blocks (LABs) | — | 9,428 |
| User I/O Pins | — | 226 (maximum) |
| Core Voltage (VCCINT) | — | 1.2 V |
| Paket | — | 484-ball FBGA (FineLine BGA) |
| Maximum Operating Frequency | — | 402 MHz |
| Configuration Method | — | SRAM-based (external flash required) |
| Lead-Free | — | Yes |