EP3CLS200F484C8N vs EP3CLS100F484C8N Perbandingan

Perbandingan bersamaan detil EP3CLS200F484C8N dari Intel dan EP3CLS100F484C8N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3CLS200F484C8N EP3CLS100F484C8N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Series Cyclone III LS Cyclone® III LS
Family Cyclone® III LS —
Logic Elements 198,464 100,448
Embedded Memory 8,211,456 bits (8.21 Mbit) —
Logic Array Blocks (LABs) [DATA_NEEDED: exact LAB count] —
Embedded Multipliers (18x18) 396 4,488 (per Cyclone III LS family handbook, 100K LE tier)
User I/O Pins 210 —
Number of PLLs 4 —
Global Clock Networks 20 —
Core Voltage 1.2 V —
Process Technology 65 nm CMOS, low-leakage TSMC 65 nm low-power (LP)
Maximum Operating Frequency 402 MHz (fabric) —
Paket 484-ball FBGA (FineLine BGA), 23 x 23 mm —
Speed Grade 8 (slowest) C8 (commercial, fastest)
Temperature Grade Commercial (0C to +85C TJ) —
Bitstream Encryption AES-128 (256-bit key via separate license) AES-128 (Cyclone III LS security feature)
Configuration Mode Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG —
Status RoHS Compliant Compliant (Pb-free, 'N' suffix)
Tipe Mounting Surface Mount (BGA) Surface Mount
Family Name — Cyclone III LS
Embedded Memory Bits — 4,451,328 bits
Number of I/O — 278 (maximum user I/O)
Number of Logic Blocks / Cells — 47 (logic blocks reported by DigChip snapshot)
Package Type — FBGA-484 (FineLine BGA, lead-free)
Pin / Ball Count — 484
Supply Voltage (Core) — 1.2 V
Suhu Kerja — 0°C to +85°C (commercial grade)
Configuration Interface — JTAG, Passive Serial, Active Serial
Level MSL — 3 (per JEDEC J-STD-020, typical for BGA)
PLLs — 4 (per Cyclone III LS family)
DSP Blocks — Integrated (multiplier-based)

Spek dan Sumber

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