EP3SE80F780C4LN vs EP3SE80F780C3N Perbandingan
Perbandingan bersamaan detil EP3SE80F780C4LN dari Intel dan EP3SE80F780C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE80F780C4LN | EP3SE80F780C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E | Stratix III |
| Logic Elements (LE) | 80,000 | — |
| Logic Array Blocks (LABs) | 3,200 | — |
| Total Embedded Memory | 6,843,392 bits (approximately 6.5 Mbit) | — |
| User I/O Count | 488 | — |
| Maximum Operating Frequency | 375 MHz | — |
| Core Voltage (VCCINT) | 0.9 V | — |
| Process Technology | 65 nm | 40 nm CMOS |
| Paket | 780-ball FC-FBGA (Flip-Chip Fine-pitch BGA) | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | C4 | C3 |
| Lead-Free / RoHS | Yes (LN suffix) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Configuration Scheme | Active Serial / Passive Parallel / Fast Passive Parallel | — |
| Hard IP Blocks | PCIe Gen1, GbE MAC/PHY, DDR2/DDR3 controllers | — |
| Logic Elements | — | 80,000 |
| Number of LABs | — | 3200 |
| Number of I/Os | — | 488 |
| Package Type | — | FBGA-780 (FineLine BGA) |
| Tegangan Pemuat | — | 0.9 V core |
| Suhu Kerja | — | 0 °C to 85 °C (commercial) |
| Internal Frequency (max) | — | 717 MHz |
| Lead-Free | — | Yes (Pb-free) |
| Memory Subsystem | — | TriMatrix embedded memory |
| DSP Blocks | — | Yes, dedicated DSP blocks |
| Status RoHS | — | Compliant |
| Total Pins | — | 780 |