EP3SL50F484C2G vs EP3SL50F484C3G Perbandingan
Perbandingan bersamaan detil EP3SL50F484C2G dari Intel dan EP3SL50F484C3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL50F484C2G | EP3SL50F484C3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 47,500 LE | — |
| Adaptive Logic Modules (ALMs) | 19,000 ALM | — |
| Embedded Memory | 2,184,192 bits (2.08 Mbit) | — |
| Maximum User I/Os | 296 I/O | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Operating Supply Voltage (Core) | 1.1 V | — |
| Maximum Operating Temperature | +85 C | — |
| Minimum Operating Temperature | 0 C | — |
| Frekuensi Bawah Maximum | 600 MHz | — |
| Process Technology | 65 nm CMOS | — |
| Paket | 484-ball FCBGA (FBGA-484) | 484-FBGA (FCBGA), 23x23 mm |
| Gaya Mounting | SMD/SMT | — |
| Packaging | Tray | — |
| Status RoHS | Compliant | Compliant |
| Total Transceivers | [DATA_NEEDED: transceiver count] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Logic Elements (LE) | — | 47,500 |
| Embedded Memory Bits | — | 2,184,192 |
| User I/O Pins | — | 296 |
| Process Node | — | 40 nm |
| DSP Blocks (18x18 multipliers) | — | 384 |
| Transceivers | — | [DATA_NEEDED: number of embedded transceivers and max data rate] |
| PLLs | — | [DATA_NEEDED: PLL count] |
| PCIe Hard IP | — | [DATA_NEEDED: PCIe hard IP version] |
| Operating Temperature Grade | — | Commercial (C3 speed grade, 0C to 85C) |
| Speed Grade | — | C3 |
| Supply Voltage Core | — | [DATA_NEEDED: VCC/VCCINT nominal] |
| Tipe Mounting | — | Surface Mount (BGA) |
| Level MSL | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | Yes |
| Bebas Halogen | — | [DATA_NEEDED: halogen-free status] |