EP4CE40F29C8 vs EP4CE40F29I7 Perbandingan
Perbandingan bersamaan detil EP4CE40F29C8 dari Intel dan EP4CE40F29I7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CE40F29C8 | EP4CE40F29I7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 39,600 | — |
| Embedded Memory Bits | 1,161,216 | — |
| Embedded Multipliers (9x9) | 116 | — |
| User I/O Pins | 532 | — |
| PLLs | 4 | 4 |
| Process Technology | 60 nm low-power | 60 nm |
| Paket | 780-ball FBGA | 780-ball FBGA (F29) |
| Package Code | F29 (FBGA) | — |
| Speed Grade | C8 | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| Configuration Memory | SRAM-based | — |
| Core Voltage | 1.2 V | 1.2 V |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements (LEs) | — | 39,600 |
| User I/Os | — | 532 |
| Embedded Memory (bits) | — | 1,161,216 |
| Embedded Memory (M9K blocks) | — | 252 |
| Embedded 18x18 Multipliers | — | 116 |
| Global Clock Networks | — | 20 |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Ball Pitch | — | 1.0 mm |
| Maximum Seated Height | — | 2.4 mm |
| Tipe Mounting | — | Surface Mount (BGA) |