EP4CE55F23C9L vs EP4CE55F23C8L Perbandingan
Perbandingan bersamaan detil EP4CE55F23C9L dari Intel dan EP4CE55F23C8L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CE55F23C9L | EP4CE55F23C8L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 55,856 | — |
| Embedded Memory | 2,396,160 bits (2.5 Mbit) | — |
| Embedded 18x18 Multipliers | 156 | — |
| PLLs | 4 | — |
| User I/Os | 324 | — |
| Paket | 484-ball FBGA (F23) | 484-FBGA |
| Speed Grade | C9 (fastest commercial/industrial) | C8 |
| Suhu Kerja | -40C to +85C (industrial) | 0 C to +85 C |
| Process Node | 60 nm low-power | — |
| Core Voltage | 1.2 V (typical) | 1.2 V |
| Configuration Method | SRAM-based, requires external flash | SRAM (volatile) / Passive Serial / JTAG |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Hard PCIe Blocks | 0 (soft PCIe via fabric) | — |
| Logic Elements | — | 55,856 |
| Embedded Memory (bits) | — | 2,396,160 |
| Number of I/Os | — | 324 |
| Number of LABs/CLBs | — | 3491 |
| Process Technology | — | 60 nm |
| Lead-Free | — | Yes |
| On-Chip 18x18 Multipliers | — | 156 |