EP4CGX50CF23C8 vs EP4CGX50CF23C7 Perbandingan
Perbandingan bersamaan detil EP4CGX50CF23C8 dari Intel dan EP4CGX50CF23C7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CGX50CF23C8 | EP4CGX50CF23C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | Cyclone IV GX |
| Device Logic Elements | 49,888 | — |
| Configurable Logic Blocks (CLBs) | 3,118 | — |
| Embedded Memory (bits) | 2,562,048 | — |
| User I/O Pins | 290 | — |
| Transceivers | Up to 8 x 3.125 Gbps | Integrated (Cyclone IV GX) |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 18x18 hardware multipliers |
| PLLs | 4 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 60 nm | 60 nm |
| Paket | 484-ball FBGA (F23), 23 x 23 mm, 1.0 mm pitch | 484-FBGA (F23) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (FBGA) |
| Operating Temperature Grade | Commercial (C) | — |
| Speed Grade | 8 | C7 |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Level MSL | [DATA_NEEDED: MSL rating] | — |
| Logic Elements | — | 49,888 |
| Logic Cells | — | 49,888 |
| Embedded Memory Bits | — | 2,562,048 bits |
| Embedded Memory Blocks | — | M9K blocks, 9 Kbit each |
| Maximum User I/O | — | 290 |
| Ball Pitch | — | 1.0 mm |
| Temperature Grade | — | Commercial (0C to +85C) |