EP4CGX75DF27C8 vs EP4CGX75DF27C7 Perbandingan
Perbandingan bersamaan detil EP4CGX75DF27C8 dari Intel dan EP4CGX75DF27C7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CGX75DF27C8 | EP4CGX75DF27C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 73,920 | — |
| Embedded Memory Bits | 4,257,792 | — |
| User I/O Pins | 310 | — |
| Embedded 18x18 Multipliers | 274 | — |
| Number of LABs/CLBs | 4630 | — |
| Total RAM Bits | 4,257,792 | — |
| Number of Transceivers | 8 | — |
| Transceiver Speed | 3.125 Gbps | — |
| Number of PLLs | 4 | — |
| Core Supply Voltage | 1.2 V | — |
| Suhu Kerja | 0C to +85C (Commercial) | [DATA_NEEDED: operating temperature range] |
| Speed Grade | 8 | — |
| Paket | 672-FBGA (F27) | 672-ball FBGA |
| Process Technology | 60 nm | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Logic Cells | — | 73,920 |
| Configurable Logic Blocks | — | 4,620 |
| User I/O | — | 310 |
| Configuration-related Bits | — | 4,257,792 |
| Tegangan Pemuat | — | 1.2 V |
| Package Body | — | 27 mm x 27 mm |
| Ball Pitch | — | 1 mm |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| REACH Status | — | [DATA_NEEDED: REACH status] |