EPF10K200SBC356-1X vs EPF10K200SBI356-2 Perbandingan
Perbandingan bersamaan detil EPF10K200SBC356-1X dari Intel dan EPF10K200SBI356-2 dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EPF10K200SBC356-1X - 200K Flex 10KE FPGA, 274 I/O, 356-BGA | Intel
EPF10K200SBC356-1X ⚠ Waktu Beli Terakhir
Perbandingan Spesifikasi
| Parameter Umum | EPF10K200SBC356-1X | EPF10K200SBI356-2 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | NRND |
| Family | FLEX 10KE | FLEX 10KS |
| Series | FLEX-10KS | — |
| Typical System Gates | 200,000 | — |
| Maximum System Gates | 513,000 | — |
| Logic Elements (LEs) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1,248 |
| Embedded Array Blocks (EABs) | 12 | 24 (98,304 bits RAM) |
| Total RAM Bits | 39,616 | — |
| User I/Os | 274 | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS SRAM |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V / 5.0 V (multi-volt I/O) | — |
| Paket | 356-LBGA (BGA-356), 35 x 35 mm, 1.27 mm pitch | 356-BGA (SB) 35×35 mm, 1.27 mm pitch |
| Operating Temperature Grade | Commercial | — |
| Speed Grade | -1 (fastest commercial bin) | -2 |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| JTAG Support | IEEE Std. 1149.1 boundary scan + ISP | — |
| Lead Free / RoHS | Yes (per -1X suffix) | — |
| Configuration Mode | SRAM-based, ISP via JTAG | — |
| Logic Elements | — | 9,984 |
| System Gates | — | 200,000 |
| User I/O Pins | — | 274 |
| Core Voltage | — | 2.5 V |
| Maximum User I/O | — | 274 |
| Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |
| In-System Programmability | — | Yes (JTAG/ByteBlaster) |
| Configuration Method | — | SRAM-based, ISP |
| Level MSL | — | [DATA_NEEDED: MSL rating] |
| Status RoHS | — | [DATA_NEEDED: RoHS status] |