EPM240F100I5N vs EPM240GF100I5N Perbandingan
Perbandingan bersamaan detil EPM240F100I5N dari Intel dan EPM240GF100I5N dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM240F100I5N | EPM240GF100I5N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX II | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Logic Elements | 240 | — |
| Macrocells | 192 | — |
| User I/Os | 80 | — |
| Package Type | FBGA-100 (FineLine BGA) | — |
| Package Code (JEDEC) | LBGA100 | — |
| Package Dimensions | 11 x 11 mm, 1.0 mm ball pitch | — |
| Logic Family | CMOS | CMOS |
| Core Supply Voltage (VCCINT) | 1.8 V | — |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Configuration Memory | Flash (non-volatile, instant-on) | — |
| User Flash Memory | 8 Kbit | — |
| Internal Oscillator | Yes | — |
| JTAG / ISP Support | Yes (IEEE 1149.1 boundary scan) | — |
| Suhu Kerja | -40 C to +100 C (industrial, I-grade) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (lead-free FBGA) | Yes (lead-free, RoHS compliant) |
| Programming Toolchain | Intel Quartus Prime / Quartus II | — |
| Logic Elements / Blocks | — | 240 LE |
| Number of Macrocells | — | 192 |
| Maximum User I/O | — | 80 |
| Propagation Delay (tpd, max) | — | 4.7 ns |
| Programmable Type | — | In-System Programmable (ISP) |
| Non-Volatile Memory | — | On-chip flash configuration |
| Internal Supply Voltage | — | 1.71 V to 1.89 V (regulated on-chip) |
| Paket | — | 100-ball FBGA (FineLine BGA), 11 mm x 11 mm, 1.0 mm pitch |
| Operating Temperature (TJ) | — | -40 C to +100 C |
| JTAG Support | — | IEEE 1149.1 / IEEE 1532 compliant |
| Vertical Migration Family | — | EPM240 / EPM570 / EPM1270 / EPM2210 in same-package footprint |