EPM570F256C3N vs EPM570F256I5N Perbandingan
Perbandingan bersamaan detil EPM570F256C3N dari Intel dan EPM570F256I5N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM570F256C3N | EPM570F256I5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | MAX II |
| Logic Elements (LEs) | 570 | — |
| Equivalent Macrocells | 440 | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| Maximum Operating Frequency | 304 MHz | — |
| Process Technology | 0.18 um, 6-layer-metal flash CMOS | — |
| Core Voltage | 2.5 V / 3.3 V | — |
| I/O Voltage Support (MultiVolt) | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| Paket | 256-ball FBGA (FineLine BGA) | 256-ball FineLine BGA (17 mm x 17 mm) |
| User I/O Count | [DATA_NEEDED: confirm exact user-IO count for F256 package] | 160 |
| Operating Temperature (C3 grade) | 0 C to +85 C (commercial) | — |
| Programming Interface | JTAG (IEEE 1532 / IEEE 1149.1) + ISP | JTAG (IEEE 1149.1) / ISP (IEEE 1532) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Level MSL | [DATA_NEEDED: MSL level not stated in provided data] | — |
| Status RoHS | Compliant (per DigiKey listing) | Compliant (N suffix = Pb-free) |
| Lead-Free | Yes (per suffix 'N' convention) | — |
| Typical Macroscopic Functions | Glue logic, bus bridging, I/O expansion, power sequencing | — |
| Logic Elements | — | 570 |
| Macrocells | — | 440 |
| User Flash Memory | — | 8 kbits (9220 bits) |
| Pin-to-Pin Delay (tPD1) | — | 5.4 ns |
| Maximum Internal Frequency | — | 304 MHz |
| Global Clock Networks | — | 4 |
| Global Clear/Reset Signals | — | 2 |
| Core Voltage (VCCINT) | — | 1.8 V |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt) |
| Suhu Kerja | — | -40C to +100C (TJ, industrial) |
| Configuration Memory | — | Internal Flash (non-volatile, instant-on) |