EPM570GF256C4N vs EPM570GF256I5 Perbandingan
Perbandingan bersamaan detil EPM570GF256C4N dari Altera dan EPM570GF256I5 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Altera
EPM570GF256C4N - 570 LEs CPLD, 4ns, 212 I/O, FBGA-256 | Intel / Altera
EPM570GF256C4N ✓ Aktif
Perbandingan Spesifikasi
| Parameter Umum | EPM570GF256C4N | EPM570GF256I5 |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II G | MAX II |
| Device Series | EPM570G | — |
| Logic Elements (LEs) | 570 | — |
| Macrocells | 440 | — |
| User I/Os | 212 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Speed Grade | C4 (tPD = 4 ns) | — |
| Pin-to-Pin Delay (tPD) | 4 ns | — |
| Internal fMAX | 304 MHz | — |
| Paket | 256-ball FineLine BGA (FBGA-256) | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch |
| Ball Pitch | 1.0 mm | — |
| Package Dimensions | 17 x 17 mm | — |
| Core Voltage | 1.8 V | — |
| I/O Bank Voltages (MultiVolt) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Suhu Kerja | -40 °C to +125 °C (industrial) | — |
| Configuration Memory | Flash (non-volatile, instant-on) | — |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable | — |
| Lead-Free / RoHS | Lead-free, FBGA package | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Device Type | — | CPLD - Complex Programmable Logic Device |
| Logic Elements | — | 570 |
| Equivalent Macrocells | — | 440 |
| Number of I/O | — | 160 |
| Number of Logic Blocks | — | [DATA_NEEDED: number of logic blocks] |
| Propagation Delay tPD (max) | — | 5.4 ns |
| Programmable Type | — | In System Programmable |
| Non-Volatile Memory | — | Yes (Flash-based) |
| Internal Supply Voltage | — | 1.71 V to 1.89 V |
| I/O Standards Supported | — | LVTTL, LVCMOS 1.5/1.8/2.5/3.3 V |
| Rentang Suhu Kerja | — | -40 °C to 100 °C (Industrial) |
| JTAG Support | — | IEEE 1149.1 boundary-scan |
| Process Technology | — | 0.18 µm 6-layer-metal flash CMOS |
| Status RoHS | — | Lead-free (per FindIC listing) |