GX36420-DNT vs GX36420 Perbandingan

Perbandingan bersamaan detil GX36420-DNT dari Renesas Electronics dan GX36420 dari Renesas Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Renesas Electronics
GX36420-DNT GX36420-DNT - 4x64Gb/s Linear Quad TIA Die | Renesas

GX36420-DNT - 4x64Gb/s Linear Quad TIA Die | Renesas

GX36420-DNT ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum GX36420-DNT GX36420
Merek Renesas Electronics Renesas Electronics
Kategori Amplifier ICs Amplifier ICs
Status Lingkungan Hidup Aktif Aktif
Device Type Linear Quad Transimpedance Amplifier (TIA) Die Linear Transimpedance Amplifier (TIA)
Number of Channels 4 (XI, XQ, YI, YQ) 4 (quad: XI, XQ, YI, YQ)
Data Rate per Lane 64 Gbps —
Application Target 400G/600G coherent optical receivers —
Integrated DC Control Interface Digital interface circuitry for DC controls —
Supply Form Bare die (DIE SALE - PRICE IN GOOD DIE - WAF) —
Paket Bare die (no package) —
Transimpedance Gain [DATA_NEEDED: Transimpedance Gain] [DATA_NEEDED: gain (kOhm)]
Bandwidth per Lane [DATA_NEEDED: Bandwidth per Lane] —
Input-Referred Noise [DATA_NEEDED: Input-Referred Noise] [DATA_NEEDED: input noise current (pA/sqrt(Hz))]
Tegangan Pemuat [DATA_NEEDED: Supply Voltage] [DATA_NEEDED: VCC / VEE]
Power Consumption [DATA_NEEDED: Power Consumption] —
Suhu Kerja [DATA_NEEDED: Operating Temperature Range] —
Differential Output Swing [DATA_NEEDED: Differential Output Swing] —
Status RoHS [DATA_NEEDED: RoHS Status] Compliant (assumed; bare die)
Level MSL Not applicable (bare die) In-pack die / wafer
Tipe Mounting Die attach / wire bond (custom packaging) —
Per-Lane Data Rate — 64 Gbps (symbol rate, NRZ/PAM)
Aggregate Bandwidth — 256 Gbps (4 x 64 Gbps)
Topologi — Linear (preserves amplitude for coherent ADC)
Output Interface — Differential, per lane
Integrated DC Control — Yes (on-die digital control interface)
Target Application — 400G / 600G coherent optical receivers
Form Factor — Bare die (DNT = die, no package)
Process Technology — SiGe BiCMOS
Rentang Suhu Kerja — [DATA_NEEDED: operating temperature range]

Spek dan Sumber

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