H5ANAG8NBJR-PBC vs H5ANAG6NBJR-RDC Perbandingan
Perbandingan bersamaan detil H5ANAG8NBJR-PBC dari SK hynix dan H5ANAG6NBJR-RDC dari SK hynix. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | H5ANAG8NBJR-PBC | H5ANAG6NBJR-RDC |
|---|---|---|
| Merek | SK hynix | SK hynix |
| Kategori | DRAM | DRAM |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit (2 GB) | 16 Gb |
| Organisasi | x8 | — |
| Supply Voltage (VDD) | 1.2 V | 1.2 V |
| Speed Grade / Data Rate | PBC suffix, DDR4-2666 class | — |
| Paket | FBGA-78 (7.5 mm x 11 mm) | FBGA (Ball Grid Array), surface mount |
| Tipe Mounting | Surface Mount | Surface Mount |
| Bank Architecture | 16 banks in 4 bank groups (DDR4 standard) | — |
| Prefetch | 8n | — |
| Tipe Antarmuka | Parallel, SSTL12 | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature Range] |
| CAS Latency (typical bin) | [DATA_NEEDED: CAS latency] | — |
| Refresh | Self refresh, 1x/2x/4x refresh modes | — |
| Die Revision | BJR | — |
| Status RoHS | Compliant (Lead-Free & Halogen-Free per Hynix family datasheet) | [DATA_NEEDED: RoHS Status] |
| Level MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Standard Package Quantity | [DATA_NEEDED: standard quantity] | — |
| Memory Organization | — | 16Gb x16 |
| Laju Data | — | 2666 Mbps (speed grade -RDC) |
| Antarmuka | — | Synchronous, double data rate |
| Clocking | — | Fully synchronous to both clock edges |
| Technology | — | CMOS |
| Standard | — | JEDEC DDR4 SDRAM |
| Application | — | Main memory |
| On-Die Termination (ODT) | — | Supported (DDR4 feature) |
| Bank Group Architecture | — | DDR4 bank groups (per JEDEC DDR4) |