ISO7761FDBQ vs ISO7041FDBQR Perbandingan
Perbandingan bersamaan detil ISO7761FDBQ dari Texas Instruments dan ISO7041FDBQR dari Texas Instruments. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Texas Instruments
ISO7761FDBQ - 6-Channel Digital Isolator, 100Mbps, 3kVrms | TI
ISO7761FDBQ ✓ AktifTexas Instruments
ISO7041FDBQR - 4-Channel 2 Mbps Low-Power Digital Isolator | TI
ISO7041FDBQR ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | ISO7761FDBQ | ISO7041FDBQR |
|---|---|---|
| Merek | Texas Instruments | Texas Instruments |
| Kategori | Interface ICs | Interface ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Product Type | Digital Isolator | Ultra-low-power four-channel digital isolator |
| Number of Channels | 6 (5 forward / 1 reverse) | — |
| Isolation Rating | 3000 Vrms (UL 1577) | — |
| Working Voltage | 1500 Vpk per VDE 0884-11 (reinforced) | — |
| Maximum Data Rate | 100 Mbps | 2 Mbps |
| Propagation Delay (Typical) | 11 ns | — |
| Pulse-Width Distortion | 4.5 ns max | — |
| Common-Mode Transient Immunity (CMTI) | 85 kV/µs (minimum) | — |
| Supply Voltage (Side 1 / Side 2) | 2.25 V to 5.5 V | — |
| Quiescent Current (per channel) | [DATA_NEEDED: quiescent current per channel] | — |
| Suhu Kerja | -55C to +125C | -55 C to +125 C (TI part-details listing) |
| Paket | 16-SSOP (DBQ), 3.90 mm body width | 16-pin SSOP (DBQ) |
| Creepage and Clearance | 8 mm | — |
| Tipe Mounting | Surface Mount | — |
| Level MSL | 2 (1 year) | — |
| Status RoHS | Compliant | — |
| Safety Certifications | UL 1577, VDE 0884-11, CSA, TUV, CQC | — |
| Tombol Aktifkan | Yes (logic-high output when input floating) | — |
| Channel Configuration | — | 3 forward / 1 reverse |
| Tegangan Pemuat | — | 2.25 V to 5.5 V |
| Isolation Voltage | — | 3000 Vrms |
| Common-Mode Transient Immunity | — | 50 kV/us (DigiKey listing); 100 kV/us (LCSC/JLCPCB listing) |
| Typical Supply Current | — | 116 uA/channel |
| Propagation Delay | — | 140 ns (LCSC/JLCPCB listing) |
| Package Body Width | — | 3.90 mm |
| Package Lead Pitch | — | 0.154 inch |
| Isolation Technology | — | Double capacitive silicon-dioxide (SiO2) insulation barrier |
| Fail-Safe Output | — | Yes |
| Multi-Voltage-Domain Interface | — | Yes |
| Logic Compatibility | — | CMOS and LVCMOS digital I/O |
| ATEX Certification | — | Listed for ISO7041 family |
| RoHS | — | Compliant (JLCPCB listing) |