K4A4G045WD-BCRC vs K4A4G045WD-BCPB Perbandingan
Perbandingan bersamaan detil K4A4G045WD-BCRC dari Samsung Electronics dan K4A4G045WD-BCPB dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K4A4G045WD-BCRC | K4A4G045WD-BCPB |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | DRAM | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gb | 4 Gb |
| Organisasi | 1G x4 | 1G x 4 |
| Die Generation | D-die | D-die |
| Supply Voltage VDD | 1.2 V | — |
| Speed Grade / Data Rate | BCRC (2400 Mbps per Samsung product selection guide) | — |
| Paket | TFBGA-78 (FBGA-78) | 78-ball TFBGA (FBGA) |
| Number of Terminals | 78 | 78 |
| Self Refresh | Yes | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Temperature Grade | [DATA_NEEDED: operating temperature range] | — |
| Clock Frequency | [DATA_NEEDED: CK frequency for BCRC bin] | — |
| Latensi CAS | [DATA_NEEDED: CL for BCRC bin] | — |
| Bank Architecture | DDR4 8 internal banks with bank groups | — |
| Refresh | Self refresh supported (per Partstack listing) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Lead Free Status | [DATA_NEEDED: lead-free status] | — |
| Packaging Option | [DATA_NEEDED: tape and reel quantity] | — |
| Speed Class | — | DDR4-2133 (PC2133) |
| Tegangan Pemuat | — | 1.2 V |
| Antarmuka | — | DDR4 parallel, double data rate |
| Terminal Form | — | Ball (BGA) |
| Package Shape | — | Rectangular |
| Burst Length | — | 8 (per Samsung DDR4 SDRAM datasheet Rev. 1.1) |
| Speed Bin Notation | — | CL-tRCD-tRP order (per Samsung ordering information) |
| Datasheet Pages | — | 66 pages (K4A4G045WD / K4A4G085WD family) |
| Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |
| Refresh Rate | — | [DATA_NEEDED: refresh interval 1x/2x/4x support] |