K4AAG085WM-BCRC vs K4AAG085WA-BCPB Perbandingan
Perbandingan bersamaan detil K4AAG085WM-BCRC dari Samsung Electronics dan K4AAG085WA-BCPB dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K4AAG085WM-BCRC | K4AAG085WA-BCPB |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM |
| Density | [DATA_NEEDED: exact density in Gb] | 16 Gbit |
| Organisasi | x8 | 2G x 8 |
| Supply Voltage (VDD) | 1.2 V | — |
| I/O Voltage (VDDQ) | 1.2 V | — |
| Max Data Rate | Up to 3200 Mbps/pin (family max per Samsung DDR4 page) | — |
| Antarmuka | SSTL12 | Parallel (DDR4) |
| Paket | 78-ball FBGA | 78FBGA |
| Tipe Mounting | Surface Mount | Surface Mount |
| Architecture | Bank-group DDR4 | — |
| Termination | On-Die Termination (ODT) | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | 0 C to 85 C (commercial grade, per K4AAG085WA family data) |
| Latensi CAS | [DATA_NEEDED: CL of -BCRC speed grade] | — |
| Clock | Differential clock CK/CK# | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant (per family listing on JLCPCB) |
| Level MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Tegangan Pemuat | — | 1.2 V |
| Speed Grade | — | [DATA_NEEDED: speed grade Mbps for BCPB suffix] |
| Clock Type | — | Synchronous, differential clock |
| Bank Architecture | — | DDR4 bank group architecture |
| DLL Mode | — | DLL Enabled mode operation (per Samsung datasheet abstract) |
| Memory Format | — | DRAM |
| Temperature Grade Code | — | C (per Samsung part number coding) |
| Speed Bin Code | — | PB (per Samsung part number coding) |