MC9S08AC48CFDE vs MC9S08AC32CFDE Perbandingan
Perbandingan bersamaan detil MC9S08AC48CFDE dari NXP Semiconductors dan MC9S08AC32CFDE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S08AC32CFDE - S08AC 8-bit MCU, 32KB Flash, 40MHz, QFN-48 | NXP
MC9S08AC32CFDE NrndPerbandingan Spesifikasi
| Parameter Umum | MC9S08AC48CFDE | MC9S08AC32CFDE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | NRND |
| Core Processor | S08 (HCS08) | — |
| Core Size | 8-Bit | — |
| Speed | 40 MHz CPU / 20 MHz internal bus | — |
| Flash Memory | 48KB (48K x 8) | — |
| RAM Size | 8KB | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| I/O Count | 38 | — |
| Paket | 48-QFN-EP (7x7 mm) / 48-VFQFN Exposed Pad | 48-QFN-EP (7x7 mm) with exposed thermal pad |
| Tipe Mounting | Surface Mount | Surface Mount |
| Architecture | CISC, HC08-derived HCS08 | — |
| Series | S08AC (Flexis series) | — |
| Tipe Memori | Flash (ROM Type: Flash) | — |
| Status RoHS | RoHS Compliant | — |
| Status Lingkungan Hidup | NRND (Not Recommended for New Designs) | NRND (Not Recommended for New Designs, per NXP product page) |
| Jumlah Pin | 48 | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | — |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Peripherals (ADC, timers) | [DATA_NEEDED: peripheral details] | — |
| Core Architecture | — | S08 (HCS08 family, 8-bit CISC) |
| Program Memory (Flash) | — | 32 KB |
| RAM | — | 1 KB |
| Maximum CPU Frequency | — | 40 MHz |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| Rentang Suhu Kerja | — | -40 C to +125 C (automotive grade) |
| Number of I/O Pins | — | 38 |
| ADC | — | 8-channel, 10-bit |
| Timers | — | 16-bit timer/PWM, plus additional 8-bit and 2-channel modules |
| Communication Interfaces | — | SCI (UART) and SPI |
| Debug Interface | — | Single-wire BDM (Background Debug Mode) |
| Internal Clock Source | — | Yes (ICS - Internal Clock Source) |
| Temperature Grade | — | Automotive (AEC-Q100 qualified per NXP product page) [DATA_NEEDED: specific AEC-Q100 grade letter] |
| Lebar Bus Data | — | 8-bit |
| MSL (Moisture Sensitivity Level) | — | MSL3 (per QFN-EP package, JEDEC J-STD-020) [DATA_NEEDED: exact floor life] |
| RoHS Compliance | — | Compliant (per NXP product page) |
| Lead-Free | — | Yes (per distributor packaging datasheet) |