MC9S08DV60MLH vs MC9S08DV16AMLF Perbandingan

Perbandingan bersamaan detil MC9S08DV60MLH dari NXP Semiconductors dan MC9S08DV16AMLF dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MC9S08DV60MLH MC9S08DV60MLH - 8-Bit 40MHz 60KB MCU | NXP | Automotive

MC9S08DV60MLH - 8-Bit 40MHz 60KB MCU | NXP | Automotive

MC9S08DV60MLH Obsolete
NXP Semiconductors
MC9S08DV16AMLF MC9S08DV16AMLF - 40MHz 16KB Flash CAN MCU | NXP | Automotive

MC9S08DV16AMLF - 40MHz 16KB Flash CAN MCU | NXP | Automotive

MC9S08DV16AMLF Nrnd

Perbandingan Spesifikasi

Parameter Umum MC9S08DV60MLH MC9S08DV16AMLF
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Obsolete NRND
Product Type 8-bit S08 automotive microcontroller 8-bit S08 automotive microcontroller
Core Processor S08 —
Core Size 8-bit —
Frekuensi Bawah Maximum 40 MHz —
Program Memory 60 KB Flash (60K × 8) 16 KB Flash (16K x 8)
RAM 4 KB 1 KB (1K x 8)
General-Purpose I/O 53 pins —
Input-Only Pins 1 pin —
Connectivity CANbus, I²C, LINbus, SCI, and SPI —
Peripheral Functions Low-voltage detection, power-on reset, PWM, and watchdog timer —
Paket 64-LQFP, 10 mm × 10 mm 48-LQFP, 7 mm x 7 mm
Terminal Count 64 terminals 48
Terminal Form Gull wing —
Package Shape Square —
Temperature Grade Automotive Automotive
Tipe Mounting Surface mount Surface mount
Part Status Obsolete —
Tegangan Pemuat [DATA_NEEDED: supply voltage range] —
Rentang Suhu Kerja [DATA_NEEDED: operating temperature range] —
EEPROM Size [DATA_NEEDED: EEPROM size] —
Status RoHS [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
CPU Core — S08 core with HC08 instruction set and BGND instruction
Maximum CPU Frequency — 40 MHz
Bus Frequency — 20 MHz
I/O Pins — 39
ADC — 16 channels, 12-bit resolution, 2.5 s conversion-time figure
Interrupt and Reset Sources — Up to 32 sources
Oscillator Type — External
Communication Features — CAN and LIN connectivity
Packaging — Tray
Program Memory Type — Flash
Manufacturer — NXP Semiconductors

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