MC9S08DZ32ACLF vs MC9S08DZ32CLF Perbandingan
Perbandingan bersamaan detil MC9S08DZ32ACLF dari NXP Semiconductors dan MC9S08DZ32CLF dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S08DZ32ACLF - 32KB Flash 8-bit CAN MCU, 40MHz LQFP-48 | NXP
MC9S08DZ32ACLF NrndPerbandingan Spesifikasi
| Parameter Umum | MC9S08DZ32ACLF | MC9S08DZ32CLF |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Obsolete |
| Core | HCS08 (S08) 8-bit CPU | — |
| Maximum CPU Frequency | 40 MHz (20 MHz bus) | — |
| Instruction Set | HC08 with BGND added | — |
| Program Memory (Flash) | 32 KB | — |
| RAM | 2 KB | — |
| EEPROM | On-chip (size [DATA_NEEDED: exact EEPROM size]) | — |
| Paket | 48-pin LQFP (7x7 mm) | 48-LQFP (7x7 mm) |
| Tegangan Pemuat | 2.7 V to 5.5 V (3.3 V / 5 V) | 3.3V/5V |
| ADC | 24-channel, 12-bit, 2.5 us conversion | 16-channel 12-bit (per family datasheet) |
| Analog Comparator | Yes (on-chip) | Yes |
| CAN | MSCAN (CAN 2.0 A/B) | — |
| SCI / LIN | SCI with LIN master support | — |
| SPI | Yes (on-chip) | — |
| I2C | Yes (on-chip) | — |
| Interrupt Sources | Up to 32 | — |
| Debug Interface | Background Debug Mode (BDM) / on-chip emulation | — |
| Suhu Kerja | -40C to +85C (automotive grade available) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Status RoHS | [DATA_NEEDED] | — |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| Architecture | — | CISC, CMOS |
| Maximum Clock Speed | — | 40 MHz |
| Program Memory Size | — | 32KB (32K x 8) FLASH |
| EEPROM Size | — | 1KB (1K x 8) |
| RAM Size | — | 2KB |
| Connectivity | — | CANbus, I2C, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 39 |
| Series | — | S08 / MC9S08DZ32 |
| Part Status | — | Obsolete (Rochester Electronics lifecycle support) |
| Packaging | — | Tray |