MC9S08PA16AVTJ vs MC9S08SH16MTJ Perbandingan

Perbandingan bersamaan detil MC9S08PA16AVTJ dari NXP Semiconductors dan MC9S08SH16MTJ dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MC9S08PA16AVTJ MC9S08PA16AVTJ - 8-Bit 20MHz 16KB Flash MCU | NXP

MC9S08PA16AVTJ - 8-Bit 20MHz 16KB Flash MCU | NXP

MC9S08PA16AVTJ ✓ Aktif
NXP Semiconductors
MC9S08SH16MTJ MC9S08SH16MTJ - 8-bit MCU 16KB Flash 40MHz | NXP Semiconductors

MC9S08SH16MTJ - 8-bit MCU 16KB Flash 40MHz | NXP Semiconductors

MC9S08SH16MTJ ✗ Akhir Hidup

Perbandingan Spesifikasi

Parameter Umum MC9S08PA16AVTJ MC9S08SH16MTJ
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Aktif Akhir Hidup
Core S08 8-bit CISC core —
Maximum Bus Frequency 20 MHz —
Flash Memory 16 KB 16 KB (16K x 8)
Supply Voltage Range 2.7 V to 5.5 V 2.7 V to 5.5 V
V-Part Operating Temperature -40 °C to 105 °C —
M-Part Operating Temperature -40 °C to 125 °C —
Paket 20-pin TSSOP 20-TSSOP (0.173 inch, 4.40 mm width)
Tipe Mounting Surface Mount Surface Mount
Architecture 8-bit embedded MCU —
Program Memory Type Flash —
Application Category Cost-sensitive automotive embedded control —
Analog Integration Integrated analog functionality —
Port Drive Control Software-selectable alternative drive strengths on supported high-current port pins —
Data Bus Single-chip embedded bus —
Manufacturer NXP Semiconductors —
Status Lingkungan Hidup Active —
Datasheet Revision MC9S08PA16_Rev.1 —
Jumlah Pin 20 pins —
Status RoHS [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Core Processor — S08 (HCS08) 8-bit CISC
Core Size — 8-bit
Frekuensi Bawah Maximum — 40 MHz
RAM Size — [DATA_NEEDED: RAM size]
ADC Resolution — 10-bit
ADC Channels — 16-channel
Interrupt/Reset Sources — up to 32
Instruction Set — HC08 with added BGND instruction
Debug Interface — Single-wire background debug interface
On-chip Debug Module — ICE, 2 comparators, 9 trigger modes, 8-deep FIFO
Suhu Kerja — -40C to +125C (automotive grade)
Terminal Form — Gull Wing
Packaging — Tube

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