MC9S08QG4CFFE vs MC9S08QD2MPC Perbandingan
Perbandingan bersamaan detil MC9S08QG4CFFE dari NXP Semiconductors dan MC9S08QD2MPC dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MC9S08QG4CFFE | MC9S08QD2MPC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Aktif |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| CPU Architecture | HCS08 CISC, HC08 instruction set with added BGND instruction | — |
| Frekuensi Bawah Maximum | 20 MHz | — |
| Program Memory Size | 4KB (4K x 8) FLASH | — |
| Tegangan Pemuat | 2.5 V / 3.3 V | 2.7 V to 5.5 V |
| Paket | 16-QFN-EP (5x5 mm), QFN EP | 8-pin PDIP (DIP-8) |
| Package Code | HVQCCN | — |
| Package Shape | Square | — |
| Number of Terminals | 16 | — |
| Terminal Form | No Lead | — |
| Temperature Grade | Industrial | — |
| Series | S08QG (QG Series, S08 Family) | — |
| Debug Features | Background debugging system, single breakpoint in-circuit plus two more on-chip | — |
| Tipe Mounting | Surface Mount | Through-Hole |
| Packaging | Tray | Tube |
| Status Lingkungan Hidup | End of Life (per NXP product page) | — |
| Program RAM Size | [DATA_NEEDED: Program RAM size] | — |
| ADC Resolution | [DATA_NEEDED: ADC resolution and channels] | — |
| Number of I/O | [DATA_NEEDED: number of GPIO] | — |
| Rentang Suhu Kerja | [DATA_NEEDED: operating temperature range] | — |
| Data Converters | [DATA_NEEDED: on-chip data converter summary] | — |
| Core | — | HCS08 (S08QD family) |
| Lebar Bus Data | — | 8 bit |
| Instruction Set | — | HC08 with BGND extension |
| Program Memory | — | 2 KB Flash |
| RAM | — | 128 bytes |
| Maximum CPU Frequency | — | 16 MHz |
| ADC | — | 4-channel, 10-bit |
| General-Purpose I/O | — | 6 pins |
| Watchdog | — | Yes (COP with dedicated internal oscillator) |
| Debug Interface | — | Background Debug Mode (BDM) |
| Internal Clock | — | Yes (internal oscillator, no external crystal required) |
| Suhu Kerja | — | -40 C to +85 C |
| Status RoHS | — | Compliant |
| Lead-Free | — | Yes |