MC9S08SH4CTJ vs MC9S08SH4CTG Perbandingan
Perbandingan bersamaan detil MC9S08SH4CTJ dari NXP Semiconductors dan MC9S08SH4CTG dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MC9S08SH4CTJ | MC9S08SH4CTG |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | NRND |
| Core Architecture | HCS08 (enhanced 8-bit) | — |
| CPU Bit Width | 8-bit | — |
| Maximum Bus Frequency | 40 MHz | — |
| Program Memory (Flash) | 4 KB (4K x 8) | — |
| RAM | 256 B | 256 B |
| Operating Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| ADC | 12-channel, 10-bit, 2.5 us conversion, auto-compare, internal temperature sensor | 12-channel, 10-bit, 2.5 µs conversion |
| Timers | MTIM, RTI, TPM (PWM) | — |
| Communication Interfaces | SCI/UART, SPI, I2C | SCI, SPI, I²C |
| Analog Comparator | Yes (integrated) | Yes |
| Paket | 20-pin TSSOP | 16-pin TSSOP |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | -40 C to +85 C (industrial, TJ suffix implied) | -40 °C to +85 °C |
| Low-Power Modes | STOP, WAIT with fast wake-up | — |
| Debug Interface | Single-wire BDM (background debug mode) | — |
| Instruction Set | HC08 with BGND extension | — |
| Interrupt Sources | Up to 32 | Up to 32 |
| Status RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Core | — | S08 (HCS08) 8-bit CISC |
| CPU Speed | — | 40 MHz (20 MHz bus) |
| Program Memory | — | 4 KB flash |
| Temperature Sensor | — | Internal |
| GPIO | — | 13 |
| Level MSL | — | 1 |
| Background Debug | — | Yes (single-wire BGND) |