MC9S12DT128CPV vs MC9S12DP512CPV Perbandingan
Perbandingan bersamaan detil MC9S12DT128CPV dari NXP Semiconductors dan MC9S12DP512CPV dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S12DT128CPV - HCS12 16-Bit 25MHz MCU 128KB Flash | NXP | 112-LQFP
MC9S12DT128CPV ObsoleteNXP Semiconductors
MC9S12DP512CPV - 16-Bit HCS12 MCU, 512KB Flash, 112-LQFP | NXP
MC9S12DP512CPV ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | MC9S12DT128CPV | MC9S12DP512CPV |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | Aktif |
| Manufacturer | NXP USA Inc. | — |
| Series | HCS12 | — |
| Core Processor | HCS12 (CPU12) | — |
| Core Size | 16-Bit | — |
| Core Architecture | CISC | — |
| Speed (E-clock) | 25 MHz | — |
| Program Memory Size | 128 KB (128K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 8 KB | 12 KB (12K x 8) |
| EEPROM Size | 2 KB | — |
| Number of I/O | 91 | — |
| Connectivity | CANbus, I2C, SCI, SPI | — |
| Peripherals | PWM, WDT | — |
| Oscillator Type | External (per datasheet family) | — |
| Tegangan Pemuat | 2.5 V / 5 V (family) | 5.0 V (4.5 V to 5.5 V) |
| Suhu Kerja | -40C to +85C (industrial) | -40 C to +85 C (industrial) |
| Paket / Case | 112-LQFP (20x20 mm) | 112-LQFP (20 x 20 mm) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Terminal Form | Gull Wing | — |
| Status RoHS | [DATA_NEEDED: per manufacturer product page] | Compliant (lead-free) |
| Core | — | HCS12 (16-bit) |
| Bus Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 512 KB (512K x 8) |
| EEPROM | — | 4 KB |
| Number of I/O Lines | — | 91 |
| ADC | — | 2 x 8-channel, 10-bit |
| PWM Channels | — | 8 |
| Enhanced Capture Timer | — | 8-channel 16-bit ECT |
| SCI (UART) | — | 2 |
| SPI | — | 1 |
| I2C | — | 1 |
| CAN | — | 1 x CAN 2.0 |
| Oscillator | — | Internal PLL with external crystal |
| Debug Interface | — | BDM (Background Debug Mode) |
| Process Technology | — | 0.25 um Flash |