MPC860DTVR50D4 vs MPC860ENCVR50D4 Perbandingan
Perbandingan bersamaan detil MPC860DTVR50D4 dari NXP Semiconductors dan MPC860ENCVR50D4 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC860DTVR50D4 | MPC860ENCVR50D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | NRND |
| Processor Type | MPC8xx PowerQUICC | MPU PowerQUICC MPC8xx |
| Core Architecture | 32-bit PowerPC | 32-Bit PowerPC |
| Number of Cores | 1 | — |
| Speed | 50 MHz | — |
| Tegangan Pemuat | 3.3 V | — |
| Paket / Case | 357-PBGA (25 x 25 mm) | 357-BBGA (PBGA, 25 x 25 mm) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Status RoHS | RoHS Compliant | RoHS Compliant |
| Lead Free Status | Lead Free | Lead Free |
| Process Technology | 0.32 um CMOS | 0.32 um CMOS |
| Communications Processor Module (CPM) | Integrated (RISC-based) | — |
| DMA Channels | 4 | — |
| Suhu Kerja | 0C to +95C | — |
| External Memory Bus | 32-bit (single/dual bus) | — |
| Core Count | — | 1 |
| Frekuensi Bawah Maximum | — | 50 MHz |
| Tegangan Pemuat Kerja | — | 3.3 V |
| Instruction Cache | — | 4 KB |
| Data Cache | — | 4 KB |
| On-chip Peripherals | — | CPM (Communications Processor Module), SCC, FCC, SMC, SPI, I2C, Ethernet MAC |
| Series | — | MPC8xx PowerQUICC |
| Rentang Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |