MPC860TCZQ50D4 vs MPC860ENVR50D4-FR Perbandingan
Perbandingan bersamaan detil MPC860TCZQ50D4 dari NXP Semiconductors dan MPC860ENVR50D4-FR dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC860TCZQ50D4 - 50MHz PowerQUICC MPU, 357-PBGA | NXP
MPC860TCZQ50D4 ✗ Akhir HidupNXP Semiconductors
MPC860ENVR50D4-FR - 50MHz PowerQUICC MPU 357-BGA | NXP Semiconductors
MPC860ENVR50D4-FR ObsoletePerbandingan Spesifikasi
| Parameter Umum | MPC860TCZQ50D4 | MPC860ENVR50D4-FR |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Motorola) |
| Part Number | MPC860TCZQ50D4 | — |
| Family | PowerQUICC / MPC8xx | — |
| Core | MPC8xx - 1 core, 32-bit | — |
| Core Architecture | PowerPC | PowerPC 603e-derived, 32-bit |
| Core Clock Speed | 50 MHz | — |
| Instruction / Data Cache | 4 KB / 4 KB (unified 8KB figure variant-dependent) | — |
| Tegangan Pemuat Kerja | 2 V to 3.6 V (per FindIC comparison page) | — |
| Paket | 357-PBGA (25x25 mm), ZQ suffix | 357-Ball PBGA (25 x 25 mm) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Suhu Kerja | -40C to +95C (industrial) | — |
| Status RoHS | Non-Compliant (per NXP product page / DigiChip datasheet) | — |
| Lead-Free | Contains lead (ZQ denotes tin-lead ball finish) | — |
| CPM (Communications Processor Module) | Integrated - HDLC, UART, Ethernet 10 Mbps support | — |
| DMA Channels | 4 | 4 |
| Memory Controller | Up to 256 MB DRAM with page mode support | SDRAM, DRAM, burst flash |
| Process Technology | 0.32 um CMOS (per FindIC description) | — |
| Status Lingkungan Hidup | End of Life (NXP Last Time Buy window passed) | — |
| Part Family | — | MPC8xx PowerQUICC |
| Core Frequency | — | 50 MHz |
| Operating Voltage | — | 3.3 V |
| Number of Cores | — | 1 |
| L1 Instruction Cache | — | 4 KB |
| L1 Data Cache | — | 4 KB |
| Communications Processor Module (CPM) | — | Yes (FCC x3, SCC x4, MCC x2, SPI, I2C) |
| Ethernet MAC | — | 10/100 Mbps integrated |
| USB | — | USB 1.1 device |
| Rentang Suhu Kerja | — | [DATA_NEEDED: extended industrial -40C to +85C presumed, confirm via datasheet] |
| Lead Free / RoHS | — | Yes (per DigiKey listing) |
| Packaging | — | Tray |
| Level MSL | — | [DATA_NEEDED: confirm via JEDEC J-STD-020 floor life] |