MPC875VR66 vs MPC870VR66 Perbandingan

Perbandingan bersamaan detil MPC875VR66 dari NXP Semiconductors dan MPC870VR66 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MPC875VR66 MPC875VR66 - 66MHz PowerQUICC MPC8xx 32-Bit MPU | NXP

MPC875VR66 - 66MHz PowerQUICC MPC8xx 32-Bit MPU | NXP

MPC875VR66 ⚠ Waktu Beli Terakhir
NXP Semiconductors
MPC870VR66 MPC870VR66 - PowerQUICC 32-Bit MPU, 66MHz, 256-PBGA | NXP

MPC870VR66 - PowerQUICC 32-Bit MPU, 66MHz, 256-PBGA | NXP

MPC870VR66 ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum MPC875VR66 MPC870VR66
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Waktu Pembelian Terakhir Aktif
Product Type Microprocessor (MPU) —
Series PowerQUICC MPC8xx PowerQUICC, MPC8xx
Core Architecture MPC8xx (PowerPC) - 32-bit —
Core Clock Frequency 66 MHz —
Performance 87 MIPS 87 MIPS
Number of Cores 1 —
Process Technology 0.18 µm CMOS —
Tegangan Pemuat 3.3 V —
Suhu Kerja 0 °C to +95 °C —
Paket 256-PBGA (23 x 23 mm) —
Ball Pitch 1.27 mm —
Tipe Mounting Surface Mount Surface Mount
Operating Mounting Type Tray —
Integrated Peripherals CPM (Communications Processor Module), SCC, HDLC, UART, SPI —
External Memory Interface Yes - SDRAM / Flash / ROM (32-bit address bus) —
Status RoHS [DATA_NEEDED: RoHS status] RoHS Compliant
Manufacturer — NXP Semiconductors
Core Processor — MPC8xx Power Architecture
Core Count — 1
Lebar Bus Data — 32-bit
Speed — 66 MHz
Tegangan Pemuat Kerja — 3.3 V
Rentang Suhu Kerja — 0C to +95C
Paket / Case — 256-BGA (PBGA), 23x23 mm
Packaging — Tray
Lead Free Status — Lead Free
Processor Type — MPC8xx PowerQUICC Communications Processor

Spek dan Sumber

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