MPX2200DP vs MPX2200A Perbandingan
Perbandingan bersamaan detil MPX2200DP dari NXP Semiconductors dan MPX2200A dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPX2200DP | MPX2200A |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Pressure Sensors | Pressure Sensors |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | NXP Semiconductors (formerly Motorola) | — |
| Series | MPX2200 | — |
| Tipe Pengukur | Differential Pressure Sensor (Piezoresistive) | — |
| Operating Pressure Range | 0 kPa to 200 kPa (0 PSI to 29.01 PSI) | 0 to 200 kPa (0 to 29.01 PSI) |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | — |
| Tipe Output | Analog Wheatstone Bridge (ratiometric) | Wheatstone Bridge (analog, mV) |
| Output Span | 0 mV to 40 mV at 10 V excitation | — |
| Sensitivity (nominal) | 0.2 mV/kPa | 0.2 mV/kPa |
| Pressure Port | Dual Male Tube, 0.19 in (4.93 mm) | — |
| Port Configuration | DP - Dual Port (differential) | — |
| Supply Voltage (recommended) | 10 V DC | — |
| Supply Voltage (max input) | 16 V DC | — |
| Suhu Kerja | -40C to +125C | -40 C to +125 C |
| Paket / Case | 4-SIP Module (Through-Hole) | 4-SIP Module (through-hole, unibody) |
| Tipe Mounting | Through Hole | Through Hole, Board Mount |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status not in provided data] |
| Minimum Order Quantity | 100 (tray pack) | — |
| Min. Package Quantity | 20 (tray) | — |
| Pressure Type | — | Absolute |
| Maximum Overpressure | — | 800 kPa (116.03 PSI) |
| Output Voltage Span | — | 0 mV to 40 mV (at 10 V excitation) |
| Supply Voltage (Excitation) | — | 10 V DC typical (max 16 V) |
| Accuracy | — | ±1% (typical) |
| Compensated Temperature Range | — | 0 C to +85 C |
| Port Style | — | No port (single-side exposed) |
| Termination Style | — | PC Pin (through-hole) |
| Jumlah Pin | — | 4 |
| Technology | — | Silicon piezoresistive, on-chip temperature compensated |