MPXM2202AS vs MPXM2102A Perbandingan
Perbandingan bersamaan detil MPXM2202AS dari NXP Semiconductors dan MPXM2102A dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPXM2202AS - 200 kPa Absolute Pressure Sensor, M-PAC | NXP
MPXM2202AS ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | MPXM2202AS | MPXM2102A |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Pressure Sensors | Pressure Sensors |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Aktif |
| Pressure Type | Absolute | — |
| Operating Pressure Range | 0 kPa to 200 kPa (0 to 29.01 PSI) | 14.5 PSI (100 kPa) |
| Maximum Overpressure | [DATA_NEEDED: maximum overpressure rating] | 58.02 PSI (400 kPa) |
| Tipe Output | Analog Wheatstone bridge (differential mV) | Wheatstone Bridge (analog, differential) |
| Full-Scale Output | 0 mV to 40 mV at 10 V excitation | — |
| Sensitivity | 0.2 mV/kPa (typical) | — |
| Supply Voltage (Excitation) | 10 V typical (max per datasheet) | — |
| Arus Pemuat | [DATA_NEEDED: typical excitation current] | — |
| Rentang Suhu Kerja | 0C to +85C (compensated) | — |
| Temperature Compensation | On-chip (0C to +85C) | — |
| Paket | M-PAC-5 (5-SMD module with top port) | 5-SMD Module (MPAK) |
| Pressure Port | Top port, 0.12 in (2.97 mm) tube | — |
| Tipe Mounting | Surface Mount | Surface Mount, Board Mount |
| Media Compatibility | Dry, non-corrosive gases only | — |
| Status RoHS | [DATA_NEEDED: RoHS status from datasheet] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Tipe Pengukur | — | Absolute Pressure |
| Output Voltage Span | — | 0 mV to 40 mV (at 10 V excitation) |
| Tegangan Pemuat | — | 10 V DC nominal |
| Operating Pressure Range (kPa) | — | 0 kPa to 100 kPa absolute |
| Pressure Port Style | — | No Port (board mount) |
| Bridge Impedance | — | 1.0 kOhm to 4.0 kOhm |
| Suhu Kerja | — | -40C to +125C |
| Termination Style | — | Gull Wing |
| Supplier Device Package | — | 5-MPAK |
| Case Outline | — | CASE 1320 |
| Technology | — | Silicon Piezoresistive, on-chip temperature compensated |