MPXV7007DP vs MPXV6115VC6U Perbandingan

Perbandingan bersamaan detil MPXV7007DP dari NXP Semiconductors dan MPXV6115VC6U dari STMicroelectronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MPXV7007DP MPXV7007DP - ±7kPa Differential Pressure Sensor | NXP | SOP-8

MPXV7007DP - ±7kPa Differential Pressure Sensor | NXP | SOP-8

MPXV7007DP ✓ Aktif
STMicroelectronics
MPXV6115VC6U MPXV6115VC6U - -115kPa Vacuum Pressure Sensor | NXP | 8-SMD

MPXV6115VC6U - -115kPa Vacuum Pressure Sensor | NXP | 8-SMD

MPXV6115VC6U ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum MPXV7007DP MPXV6115VC6U
Merek NXP Semiconductors STMicroelectronics
Kategori Pressure Sensors Pressure Sensors
Status Lingkungan Hidup Aktif Aktif
Pressure Type Differential Vacuum / Gage (negative)
Operating Pressure Range -7 kPa to +7 kPa -16.68 PSI to 0 PSI (-115 kPa to 0 kPa)
Pressure Range (psi) -1.02 psi to +1.02 psi —
Tegangan Pemuat 4.75 V to 5.25 V (5 V typical) 5 V (typical, ratiometric)
Tipe Output Analog, ratiometric Analog, ratiometric
Rentang Tegangan Output 0.5 V to 4.5 V —
Output at Zero Pressure 2.5 V (typical, nominal) —
Arus Pemuat [DATA_NEEDED: supply current] —
Accuracy 5% (over 0 C to 85 C) 1.5% (typical)
Rentang Suhu Kerja 0 C to +85 C (compensated, per datasheet) —
Storage Temperature Range -30 C to +100 C —
Response Time 1 ms (typical) —
Port Configuration Dual port, same side (Dual Horizontal) —
Port Size Male, 0.13 in (3.3 mm) tube 0.13" (3.17 mm) Tube Male
Paket / Case 8-BSOP (0.475 in / 12.06 mm width) —
Tipe Mounting Surface Mount Surface Mount
Status RoHS Compliant Compliant
Manufacturer — NXP Semiconductors (formerly Freescale)
Maximum Overpressure — [DATA_NEEDED: maximum overpressure rating]
Tegangan Output — 0.2 V to 4.6 V (at 5 V supply)
Port Style — Top port, vertical tube, 3.17 mm (0.13 in)
Paket — 8-SMD, Gull Wing, Top Port
Suhu Kerja — -40 C to +125 C
Technology — Piezoresistive, on-chip signal conditioned
Compensation — On-chip temperature compensated and calibrated

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