MT47H64M16HR-25E IT:H vs W971GG6SB25I Perbandingan

Perbandingan bersamaan detil MT47H64M16HR-25E IT:H dari Micron Technology dan W971GG6SB25I dari Winbond. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Micron Technology
MT47H64M16HR-25E IT:H MT47H64M16HR-25E IT:H - 1Gb DDR2 SDRAM 400MHz 84-FBGA | Micron

MT47H64M16HR-25E IT:H - 1Gb DDR2 SDRAM 400MHz 84-FBGA | Micron

MT47H64M16HR-25E IT:H ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum MT47H64M16HR-25E IT:H W971GG6SB25I
Merek Micron Technology Winbond
Kategori Memory ICs Memory ICs
Status Lingkungan Hidup Aktif Aktif
Tipe Memori DDR2 SDRAM (volatile) Volatile, DDR2 SDRAM
Ukuran Memori 1 Gbit (64M x 16) —
Organisasi 8 Meg x 16 x 8 banks 8M words × 8 banks × 16 bits
Clock Frequency 400 MHz 200 MHz
Access Time 400 ps —
Data Rate (effective) 800 MT/s —
Antarmuka Parallel (byte-wide) —
Prefetch Architecture 4n-bit —
Supply Voltage VDD 1.8 V ±0.1 V —
Supply Voltage VDDQ 1.8 V ±0.1 V (SSTL_18) —
I/O Standard JEDEC SSTL_18-compatible —
Data Strobe Differential (DQS, DQS#) —
Paket 84-TFBGA (8 mm x 12.5 mm) —
Suhu Kerja -40C to +85C (Industrial, IT:H) -40 °C to +85 °C (industrial)
Status RoHS Compliant (lead-free) Compliant (lead-free)
Density — 1 Gbit (1,073,741,824 bits)
Maximum Data Rate — 400 MT/s (DDR2-800)
Random Access Time — 57.5 ns
Bus Width — 16 bits
Supply Voltage (VDD / V_DDQ) — 1.8 V (JEDEC SSTL-18)
Tipe Antarmuka — Parallel, SSTL-18
Package Type — 84-WBGA / 84-TFBGA, 8.0 × 12.5 mm
Tipe Mounting — Surface Mount
Number of Pins / Balls — 84
Bank Count — 8
On-Die Termination (ODT) — Yes (per JEDEC DDR2)
Refresh — Auto-refresh and self-refresh
Speed Grade Suffix — 25I (DDR2-800 6-6-6, industrial)
Compliance — JEDEC DDR2 standard

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