P1020NSE2FFB vs P1012NSN2DFB Perbandingan
Perbandingan bersamaan detil P1020NSE2FFB dari NXP Semiconductors dan P1012NSN2DFB dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
P1020NSE2FFB - QorIQ P1 Dual-Core 800MHz SoC | NXP Semiconductors
P1020NSE2FFB ⚠ Waktu Beli TerakhirNXP Semiconductors
P1012NSN2DFB - QorIQ P1 PowerPC e500v2 MPU 800MHz | NXP
P1012NSN2DFB ✗ Akhir HidupPerbandingan Spesifikasi
| Parameter Umum | P1020NSE2FFB | P1012NSN2DFB |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Akhir Hidup |
| Processor Type | QorIQ P1 series, dual-core PowerPC e500v2 | PowerPC e500v2 |
| Number of Cores | 2 | — |
| Core Frequency | 667 MHz (core), 333 MHz (platform), 667 MHz (core2) | — |
| Marketing / Maximum Frequency | 800 MHz | — |
| Process Technology | 45 nm | 45 nm |
| Lebar Bus Data | 32-bit | 32-bit |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Ethernet | Integrated GbE (3x MAC) | Dual Gigabit Ethernet (eTSEC) |
| PCIe | PCIe Gen1 / Gen2 | — |
| USB | USB 2.0 | 2 x USB 2.0 (host + device) |
| Security Engine | SEC (hardware-accelerated crypto) | — |
| TDM / Serial Interface | Yes (TDM) | — |
| Paket | 689-TEPBGA II (31x31 mm) | — |
| Suhu Kerja | 0C to 125C (Tj) | 0C to +125C |
| Package Type | 689-BBGA Exposed Pad (Tray) | — |
| Lead Free / RoHS | Lead Free, RoHS Compliant | — |
| Tegangan Pemuat | [DATA_NEEDED: exact Vcore/Vdd nominal] | — |
| Junction Temperature Max | 125 C | — |
| Manufacturer | — | NXP Semiconductors |
| Series | — | QorIQ P1 |
| Core Count | — | 1 |
| Max Clock Frequency | — | 800 MHz |
| Paket / Case | — | 689-TEPBGA II (31x31 mm), exposed pad |
| L1 Cache (I/D) | — | 32 KB / 32 KB |
| L2 Cache | — | 256 KB platform cache |
| PCI Express | — | 3 x PCIe Gen 1 controllers |
| TDM / Telecom | — | QUICC Engine (UTOPIA / TDM / HDLC) |
| Cryptography | — | SEC 3.1 |
| Packaging | — | Tray |
| Lead Free Status | — | Lead Free |
| Status RoHS | — | RoHS Compliant |