XC6SLX45-3FGG484I vs XC6SLX45-2FGG484I Perbandingan

Perbandingan bersamaan detil XC6SLX45-3FGG484I dari AMD dan XC6SLX45-2FGG484I dari AMD. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum XC6SLX45-3FGG484I XC6SLX45-2FGG484I
Merek AMD AMD
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Unknown Aktif
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Spartan-6 LX —
Logic Cells 43,661 cells 43,661
Adaptive Logic Modules 6,822 ALMs —
Configurable Logic Blocks 3,411 CLBs —
Internal Frequency 500 MHz —
Maximum Operating Frequency 862 MHz —
Input and Output Count 316 I/O —
Package Type 484-BBGA —
Package Body Size 15 mm x 15 mm —
Ball Pitch 0.80 mm —
Process Technology 45 nm CMOS 45 nm low-power CMOS
Speed Grade -3 -2
Temperature Grade I (industrial) —
Suhu Kerja 0°C to 85°C —
Lead-Free Status Lead-free package —
Board Construction Reference MO-275 —
Tipe Mounting Surface mount —
RoHS Compliance [DATA_NEEDED: RoHS compliance status] Lead-free / RoHS compliant
REACH Compliance [DATA_NEEDED: REACH compliance status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Family — Spartan-6 LX
Logic Slices — 6,822
Flip-Flops — 54,576
Block RAM — 2,138,112 bits (2,088 Kb/s)
DSP Slices (DSP48A1) — 58
Maximum User I/O — 316
Paket — 484-ball BGA (FBGA-484)
Package Dimensions — 23 x 23 mm, 1.0 mm ball pitch
Operating Temperature (I grade) — -40C to +100C (industrial)
Supply Voltage Core — 1.2 V typical
Clock Management Tiles — 6 CMT (4 DCM + 2 PLL)
Maximum I/O Speed — 800 Mbps LVDS
Memory Interface Support — DDR, DDR2, DDR3, LPDDR
Configuration Memory — AES-256 bitstream encryption

Spek dan Sumber

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