APA300-FG144I - 300K Gate ProASICPLUS FPGA | Microchip Technology
MPN: APA300-FG144I ✗ Akhir HidupAPA300-FG144I Ringkasan
An FPGA is a programmable semiconductor containing configurable logic blocks and programmable interconnect resources. After configuration, the internal logic can implement control logic, interface bridging, data acquisition, protocol handling, and other parallel-processing functions. The APA300 family is positioned as a low-density programmable-logic platform within the broader FPGA and programmable-logic semiconductor hierarchy.
The APA300-FG144I provides approximately 300K system gates and 100 I/O according to the manufacturer product information. Its 2.5 V operating supply and 144-pin FBGA package make it suitable for compact embedded boards where the system requires deterministic programmable logic, moderate I/O density, and nonvolatile configuration. The package also requires careful ball-layout planning and multilayer PCB construction to preserve signal integrity.
ProASICPLUS devices combine programmable logic with embedded Flash configuration technology. This architecture supports reprogramming during development, manufacturing, and field updates, while also providing a different implementation path from SRAM-based FPGAs that require configuration data to be loaded after power-up. The -FG144I suffix identifies the 144-pin package and industrial-temperature ordering variant; use the manufacturer ordering guide for the definitive temperature-grade interpretation.
Typical applications include industrial control, instrumentation, communications equipment, test and measurement, embedded control, and signal-processing front ends. The device can implement parallel state machines, bus controllers, custom interfaces, and logic functions that would otherwise require multiple programmable or fixed-function devices. Its 100 I/O provide substantial board connectivity for buses, counters, control signals, and serial links when the selected package has the required dedicated pins.
When laying out a board, treat the 144-pin FBGA as a fine-pitch component with controlled escape routing and multiple ground connections. Follow the manufacturer package drawing and pin table when assigning power, ground, configuration, clock, and user I/O signals. Place the device according to the recommended footprint, maintain the specified power and decoupling network, and account for thermal dissipation at the package level.
This product page combines the APA300-FG144I identification data, package information, technical comparison guidance, replacement criteria, and practical design notes into a focused engineering reference for embedded programmable-logic designs.
Alternatif penggantian untuk APA300-FG144I — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian APA300-FG144I (sama faktor bentuk dan footprint) — berbeda di dalam Package, System Gates, AEC-Q100 Qualification, Configuration Memory, Device Type.
APA300-FG144
✅ Drop-InKontak untuk harga
Lihat Datasheet →APA300-FGG144
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Lihat Datasheet →APA300-FGG144I
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
APA300-FG144I Rating Maksimal & Karakteristik Listrik
| Device Type | ProASICPLUS field-programmable gate array (FPGA) |
| System Gates | 300K gates |
| I/O Count | 100 I/O |
| Paket | 144-pin FBGA |
| Tegangan Pemuat | 2.5 V |
| Maximum Frequency | 180 MHz |
| Configuration Technology | Flash |
| Programmability | Nonvolatile and reprogrammable |
| Technology | 0.22 um CMOS |
APA300-FG144I 144-pin fbga Diamant Konfigurasi Panduan
Konfigurasi pin untuk APA300-FG144I (144-pin fbga pakai pakai). IC digital ini termasuk GPIO, antarmuka komunikasi (UART, SPI, I2C), dan pin kuasa. Lihat datasheet produsen untuk fungsi pin alternatif dan opsi konfigurasi. Penting untuk desain sistem pengemasan dan PCB.
Tidak ada data diatribut pin yang tersedia untuk APA300-FG144I.
Lihat ke: datasheet produk untuk konfigurasi pin penuh.
Aplikasi Umum
APA300-FG144I cocok untuk 6 aplikasis: Industrial Control and Automation, Instrumentation and Data Acquisition, Communications Interface Consolidation, Test and Measurement Systems, Embedded Control Coprocessor, Audio and Signal Processing.
Industrial Control and Automation
The APA300-FG144I suits industrial control equipment that requires programmable sequencing, timing, and interface logic close to sensors and actuators. Its 300K system gates provide capacity for parallel control paths, while 100 I/O support digital inputs, outputs, counters, interlocks, and bus signals in a 144-pin FBGA. The 2.5 V device can consolidate functions that otherwise require several programmable logic devices. Engineers should reserve the 180 MHz operating point for timing closure and validate the -FG144I industrial-temperature ordering option for the installation environment.
Direkomendasikan
Instrumentation and Data Acquisition
The APA300-FG144I is useful for instrumentation front ends that require parallel channel control, timing generation, trigger logic, and data-format conversion. Its 300K system gates can host programmable acquisition sequencing and interface control, while the 100 I/O provide broad connectivity to converters, sensors, and status signals. Placing this programmable logic beside the measurement chain can reduce system partitioning and deterministic timing uncertainty. Signal-integrity and thermal analysis should account for the 144-pin FBGA footprint and the 2.5 V supply requirement.
Direkomendasikan
Communications Interface Consolidation
The APA300-FG144I can consolidate protocol converters, FIFO-based data handling, framing logic, and parallel-to-serial interface functions in networking and communications equipment. The device supplies 300K system gates and 100 I/O for control paths and external interfaces, and its Flash-based configuration supports nonvolatile, reprogrammable operation. This combination is valuable when the system must support several interface modes without relying on multiple fixed-function controllers. Clock budgeting, I/O standards, impedance control, and configuration-security requirements must be verified before production release.
Direkomendasikan
Test and Measurement Systems
The APA300-FG144I is appropriate for programmable test systems where sequencers, pattern generation, limit checking, and instrument-control logic must operate in parallel. Its 300K system gates and 100 I/O provide enough programmable connectivity for multi-channel control and data routing, while the 144-pin FBGA supports compact multi-layer assemblies. Nonvolatile Flash configuration allows operational logic to be updated without volatile SRAM configuration. The implementation must be checked for timing margin, embedded-memory limits, pin assignment constraints, and fixture signal integrity.
Direkomendasikan
Embedded Control Coprocessor
The APA300-FG144I can act as a programmable coprocessor beside a microcontroller, handling deterministic state machines, bus arbitration, waveform generation, or peripheral emulation. The FPGA provides 300K system gates and 100 I/O for parallel work that would otherwise burden the host processor, while Flash configuration preserves the programmed logic between power cycles. This architecture is useful for embedded control boards with demanding timing or several interacting interfaces. Partition functions carefully and verify clock-domain boundaries, configuration update timing, and the industrial temperature range.
Direkomendasikan
Audio and Signal Processing
The APA300-FG144I can implement parallel digital filtering, sample routing, clock division, and format conversion in audio and general signal-processing systems. Its 300K system gates support multiple concurrent datapaths, while 100 I/O allow direct connection to converters, memory, and synchronization logic. Flash-based configuration supports field updates and repeatability across production units. Clocking and I/O timing are the principal constraints for high-rate data paths, so engineers should use the manufacturer timing tools and complete board-level signal-integrity validation.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk APA300-FG144I — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | APA300-FG144 | APA300-FGG144 | APA300-FGG144I |
|---|---|---|---|---|
| Package | 144-pin FBGA | 144-pin FBGA | 144-pin FBGA | 144-pin FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Product Family | ProASICPLUS | ProASICPLUS | ProASICPLUS | ProASICPLUS |
| System Gates | 300K gates | 300K gates | 300K gates | 300K gates |
| Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Configuration Technology | Flash | Flash | Flash | Flash |
| Technology | 0.22 um CMOS | 0.22 um CMOS | 0.22 um CMOS | 0.22 um CMOS |
| I/O Count | 100 I/O | 100 I/O | 100 I/O | 100 I/O |
Diferensiator Kunci
- Lower maximum frequency than the 200 MHz APA300-FG144 ordering variant (vsAPA300-FG144)
- Industrial-temperature ordering option (vsAPA300-FGG144)
- Defined maximum frequency supports a 180 MHz design target (vsAPA300-FGG144I)
Catatan Desain
Use the manufacturer footprint and escape-routing guidance for the 144-pin FBGA. Place the device so every BGA ball can escape through adjacent microvias or a multilayer via structure without long stubs. Preserve the recommended ground reference beneath signal escapes, maintain lane geometry for the intended signal class, and follow the package-specific solder-mask and land-pattern dimensions rather than approximating them from the ball count.
Build the 2.5 V core and I/O supply network from the manufacturer power-distribution guidelines. Place local bulk and high-frequency decoupling capacitors at the associated package power balls, use short ground returns, and distribute supply connections across the package where the recommended layout requires it. Verify startup sequencing, voltage tolerances, and configuration requirements against the electrical characteristics table before committing the board.
The 144-pin FBGA can route heat into an inner PCB layer and thermal vias. Follow the package thermal recommendations for via count, diameter, and pad connection, and provide adequate copper area beneath the device. Estimated thermal performance depends on actual dissipation, board construction, ambient temperature, airflow, and copper geometry, so calculate the junction margin for the industrial-temperature condition rather than assuming the package rating alone is sufficient.
Design clock inputs and high-speed user I/O with controlled impedance, short return paths, and continuous reference planes. Account for FBGA breakout delay, via transitions, loading, and clock skew in timing closure. Avoid routing sensitive signals across split power or ground regions, and validate the assembled board with the intended edge rates and termination arrangements rather than relying only on schematic connectivity.
Do not treat related APA300 ordering codes as automatically interchangeable. A replacement must preserve the 144-pin ballout, 2.5 V supply arrangement, configuration method, required I/O functions, operating temperature, and minimum timing grade. Compare APA300-FG144I against APA300-FG144, APA300-FGG144, or APA300-FGG144I in the manufacturer ordering guide, then recompile the design and verify pin assignment and timing after any ordering-code change.
Informasi Konformitas
The manufacturer product information identifies an industrial-temperature APA300 ordering variant but does not state the requested compliance statuses. Verify RoHS, REACH, lead-free, halogen-free, conflict-minerals, and automotive qualification documents for the exact ordering code.
