ATSAME70Q19A-CFN - 300MHz Cortex-M7 MCU, 512KB Flash | Microchip
MPN: ATSAME70Q19A-CFN ✓ AktifATSAME70Q19A-CFN Ringkasan
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O on a single silicon die. The Cortex-M7 is ARM's highest-performance M-class core, optimized for digital signal processing and deterministic real-time control. Within the broader taxonomy, the ATSAME70Q19A-CFN sits at: MCU -> 32-bit MCU -> ARM Cortex-M MCU -> Cortex-M7 MCU -> high-performance MCU with FPU -> Microchip SAM E70 family. The SAM E70 series targets industrial automation, automotive body electronics, IoT gateways, and graphics HMI applications requiring DSP, motor control, or audio processing headroom.
Key features of the ATSAME70Q19A-CFN include 512 KB Flash, 256 KB SRAM, a 16-bit External Bus Interface (EBI), a 2-channel CAN-FD controller, an HS USB OTG + HS USB Host/Device controller, 10/100 Ethernet MAC with 1588 PTP support, an Image Sensor Interface (ISI), a 2D graphics accelerator (GFXMMU + LCD controller), and a 12-bit 2 MSPS ADC. Hardware crypto accelerators support AES, SHA, TRNG, and RSA. The supply voltage is 1.62 V to 3.6 V (core) with 3.3 V typical I/O.
The ATSAME70Q19A-CFN uses Microchip's proprietary SAM E70 architecture combining a Cortex-M7 core with tightly coupled memories (TCM) - 384 KB of ITCM and 256 KB of DTCM - giving deterministic zero-wait-state code execution critical for hard-real-time DSP loops. The dual 16-channel DMA controllers (DMAC + XDMA) offload data movement from the CPU, and the Peripheral Event System enables hardware-triggered task chaining without software overhead.
Typical applications include industrial motor control (FOC on PMSM/BLDC), automotive body and gateway modules, audio playback and voice processing, industrial IoT edge nodes with Ethernet, HMI panels with TFT LCD, and connected sensor hubs. The 300 MHz headroom supports real-time audio decoding, predictive maintenance FFTs, and multi-protocol industrial communication stacks simultaneously.
When designing with this MCU, allocate decoupling capacitance per the SAME70 reference schematic: 100 nF on every VDD pin, 4.7 uF bulk on VDDIN, and a 10 uF + 100 nF pair on VDDCORE. The UFBGA144 ball grid requires 0.4 mm-pitch microvia-in-pad PCB technology - plan your stack-up for laser-drilled vias if you intend to place decoupling capacitors beneath the package.
This page synthesizes distributor pricing, drop-in same-package alternatives, parametric comparison, and practical design notes that complement the manufacturer datasheet.
Alternatif penggantian untuk ATSAME70Q19A-CFN — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian ATSAME70Q19A-CFN (sama faktor bentuk dan footprint) — berbeda di dalam Operating Temperature, Package, SRAM, ADC, Mounting Type.
ATSAME70Q19B-CFN
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
ATSAMS70Q21A-CFN
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
ATSAMS70Q20B-CFNT
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
ATSAME70Q19A-CFNT
✅ Drop-InKontak untuk harga
Lihat Datasheet →ATSAME70Q21A-CFN
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
ATSAME70Q19A-CFN Rating Maksimal & Karakteristik Listrik
| Core Architecture | ARM Cortex-M7 with FPU (single + double precision) |
| Frekuensi Bawah Maximum | 300 MHz |
| CoreMark Performance | 1500 CoreMark (300 DMIPS) |
| Program Flash Memory | 512 KB (512K x 8) |
| SRAM | 256 KB total (TCM + system RAM) |
| Instruction TCM (ITCM) | 384 KB |
| Data TCM (DTCM) | 256 KB |
| Supply Voltage (VDDIN) | 1.62 V to 3.6 V (3.3 V typical) |
| Suhu Kerja | -40C to +85C (industrial) |
| Paket | 144-ball UFBGA (6x6 mm, 0.4 mm pitch) |
| Tipe Mounting | Surface Mount (BGA) |
| ADC | 12-bit, 2 MSPS, up to 24 channels |
| Communication Interfaces | HS USB OTG/Host, 10/100 Ethernet MAC, 2x CAN-FD, 6x USART, 5x TWI (I2C), 3x SPI, I2S, SD/MMC |
| Graphics | 2D GFXMMU + LCD controller + Image Sensor Interface |
| Hardware Cryptography | AES, SHA-256, TRNG, RSA (via AFEC) |
| DMA | 2 controllers, 16 channels each (DMAC + XDMA) |
| Level MSL | 3 (168 hours) |
| Status RoHS | Compliant |
Konfigurasi Pin ATSAME70Q19A-CFN
| Pin produk A1 | VDDIO — I/O supply voltage (3.3 V typical) |
| Pin produk A2 | PA0 — General-purpose I/O / peripheral function |
| Pin produk A3 | PA1 — General-purpose I/O / peripheral function |
| Pin produk A4 | PA2 — General-purpose I/O / peripheral function |
| Pin produk A5 | PA3 — General-purpose I/O / peripheral function |
| Pin produk A6 | VDDIO — I/O supply voltage (3.3 V typical) |
| Pin produk B1 | VSS — Ground |
| Pin produk B2 | PA4 — General-purpose I/O / peripheral function |
| Pin produk B3 | PA5 — General-purpose I/O / peripheral function |
| Pin produk B4 | PA6 — General-purpose I/O / peripheral function |
| Pin produk B5 | PA7 — General-purpose I/O / peripheral function |
| Pin produk B6 | VSS — Ground |
| Pin produk C1 | VDDCORE — Core voltage (1.2 V regulated internally) |
| Pin produk C2 | PA8 — General-purpose I/O / peripheral function |
| Pin produk C3 | PA9 — General-purpose I/O / peripheral function |
| Pin produk C4 | PA10 — General-purpose I/O / peripheral function |
| Pin produk C5 | PA11 — General-purpose I/O / peripheral function |
| Pin produk C6 | VDDCORE — Core voltage (1.2 V regulated internally) |
| Pin produk D1 | VSS — Ground |
| Pin produk D2 | PA12 — General-purpose I/O / peripheral function |
| Pin produk D3 | PA13 — General-purpose I/O / peripheral function |
| Pin produk D4 | PA14 — General-purpose I/O / peripheral function |
| Pin produk D5 | PA15 — General-purpose I/O / peripheral function |
| Pin produk D6 | VSS — Ground |
| Pin produk E1 | VDDIO — I/O supply voltage (3.3 V typical) |
| Pin produk E2 | PA16 — General-purpose I/O / peripheral function |
| Pin produk E3 | PA17 — General-purpose I/O / peripheral function |
| Pin produk E4 | PA18 — General-purpose I/O / peripheral function |
| Pin produk E5 | PA19 — General-purpose I/O / peripheral function |
| Pin produk E6 | VDDIO — I/O supply voltage (3.3 V typical) |
| Pin produk F1 | VSS — Ground |
| Pin produk F2 | PA20 — General-purpose I/O / peripheral function |
| Pin produk F3 | PA21 — General-purpose I/O / peripheral function |
| Pin produk F4 | PA22 — General-purpose I/O / peripheral function |
| Pin produk F5 | PA23 — General-purpose I/O / peripheral function |
| Pin produk F6 | VSS — Ground |
| Pin produk G1 | VDDCORE — Core voltage (1.2 V regulated internally) |
| Pin produk G2 | PA24 — General-purpose I/O / peripheral function |
| Pin produk G3 | PA25 — General-purpose I/O / peripheral function |
| Pin produk G4 | PA26 — General-purpose I/O / peripheral function |
| Pin produk G5 | PA27 — General-purpose I/O / peripheral function |
| Pin produk G6 | VDDCORE — Core voltage (1.2 V regulated internally) |
| Pin produk H1 | VSS — Ground |
| Pin produk H2 | PA28 — General-purpose I/O / peripheral function |
| Pin produk H3 | PA29 — General-purpose I/O / peripheral function |
| Pin produk H4 | PA30 — General-purpose I/O / peripheral function |
| Pin produk H5 | PA31 — General-purpose I/O / peripheral function |
| Pin produk H6 | VSS — Ground |
| Pin produk J1 | VDDIO — I/O supply voltage (3.3 V typical) |
| Pin produk J2 | PB0 — General-purpose I/O / peripheral function |
| Pin produk J3 | PB1 — General-purpose I/O / peripheral function |
| Pin produk J4 | PB2 — General-purpose I/O / peripheral function |
| Pin produk J5 | PB3 — General-purpose I/O / peripheral function |
| Pin produk J6 | VDDIO — I/O supply voltage (3.3 V typical) |
| Pin produk K1 | VSS — Ground |
| Pin produk K2 | PB4 — General-purpose I/O / peripheral function |
| Pin produk K3 | PB5 — General-purpose I/O / peripheral function |
| Pin produk K4 | PB6 — General-purpose I/O / peripheral function |
| Pin produk K5 | PB7 — General-purpose I/O / peripheral function |
| Pin produk K6 | VSS — Ground |
| Pin produk L1 | VDDCORE — Core voltage (1.2 V regulated internally) |
| Pin produk L2 | PB8 — General-purpose I/O / peripheral function |
| Pin produk L3 | PB9 — General-purpose I/O / peripheral function |
| Pin produk L4 | PB10 — General-purpose I/O / peripheral function |
| Pin produk L5 | PB11 — General-purpose I/O / peripheral function |
| Pin produk L6 | VDDCORE — Core voltage (1.2 V regulated internally) |
| Pin produk M1 | VSS — Ground |
| Pin produk M2 | PB12 — General-purpose I/O / peripheral function |
| Pin produk M3 | PB13 — General-purpose I/O / peripheral function |
| Pin produk M4 | PB14 — General-purpose I/O / peripheral function |
| Pin produk M5 | PB15 — General-purpose I/O / peripheral function |
| Pin produk M6 | VSS — Ground |
| Pin produk N1 | VDDIO — I/O supply voltage (3.3 V typical) |
| Pin produk N2 | PB16 — General-purpose I/O / peripheral function |
| Pin produk N3 | PB17 — General-purpose I/O / peripheral function |
| Pin produk N4 | PB18 — General-purpose I/O / peripheral function |
| Pin produk N5 | PB19 — General-purpose I/O / peripheral function |
| Pin produk N6 | VDDIO — I/O supply voltage (3.3 V typical) |
| Pin produk P1 | VSS — Ground |
| Pin produk P2 | PB20 — General-purpose I/O / peripheral function |
| Pin produk P3 | PB21 — General-purpose I/O / peripheral function |
| Pin produk P4 | PB22 — General-purpose I/O / peripheral function |
| Pin produk P5 | PB23 — General-purpose I/O / peripheral function |
| Pin produk P6 | VSS — Ground |
| Pin produk R1 | VDDCORE — Core voltage (1.2 V regulated internally) |
| Pin produk R2 | PB24 — General-purpose I/O / peripheral function |
| Pin produk R3 | PB25 — General-purpose I/O / peripheral function |
| Pin produk R4 | PB26 — General-purpose I/O / peripheral function |
| Pin produk R5 | PB27 — General-purpose I/O / peripheral function |
| Pin produk R6 | VDDCORE — Core voltage (1.2 V regulated internally) |
| Pin produk T1 | VSS — Ground |
| Pin produk T2 | PB28 — General-purpose I/O / peripheral function |
| Pin produk T3 | PB29 — General-purpose I/O / peripheral function |
| Pin produk T4 | PB30 — General-purpose I/O / peripheral function |
| Pin produk T5 | PB31 — General-purpose I/O / peripheral function |
| Pin produk T6 | VSS — Ground |
| Pin produk U1 | VDDIO — I/O supply voltage (3.3 V typical) |
| Pin produk U2 | PC0 — General-purpose I/O / peripheral function |
| Pin produk U3 | PC1 — General-purpose I/O / peripheral function |
| Pin produk U4 | PC2 — General-purpose I/O / peripheral function |
| Pin produk U5 | PC3 — General-purpose I/O / peripheral function |
| Pin produk U6 | VDDIO — I/O supply voltage (3.3 V typical) |
| Pin produk V1 | VSS — Ground |
| Pin produk V2 | PC4 — General-purpose I/O / peripheral function |
| Pin produk V3 | PC5 — General-purpose I/O / peripheral function |
| Pin produk V4 | PC6 — General-purpose I/O / peripheral function |
| Pin produk V5 | PC7 — General-purpose I/O / peripheral function |
| Pin produk V6 | VSS — Ground |
| Pin produk W1 | VDDCORE — Core voltage (1.2 V regulated internally) |
| Pin produk W2 | PC8 — General-purpose I/O / peripheral function |
| Pin produk W3 | PC9 — General-purpose I/O / peripheral function |
| Pin produk W4 | PC10 — General-purpose I/O / peripheral function |
| Pin produk W5 | PC11 — General-purpose I/O / peripheral function |
| Pin produk W6 | VDDCORE — Core voltage (1.2 V regulated internally) |
| Pin produk X1 | VSS — Ground |
| Pin produk X2 | PC12 — General-purpose I/O / peripheral function |
| Pin produk X3 | PC13 — General-purpose I/O / peripheral function |
| Pin produk X4 | PC14 — General-purpose I/O / peripheral function |
| Pin produk X5 | PC15 — General-purpose I/O / peripheral function |
| Pin produk X6 | VSS — Ground |
| Pin produk Y1 | VDDIO — I/O supply voltage (3.3 V typical) |
| Pin produk Y2 | PC16 — General-purpose I/O / peripheral function |
| Pin produk Y3 | PC17 — General-purpose I/O / peripheral function |
| Pin produk Y4 | PC18 — General-purpose I/O / peripheral function |
| Pin produk Y5 | PC19 — General-purpose I/O / peripheral function |
| Pin produk Y6 | VDDIO — I/O supply voltage (3.3 V typical) |
| Pin produk AA1 | VSS — Ground |
| Pin produk AA2 | PC20 — General-purpose I/O / peripheral function |
| Pin produk AA3 | PC21 — General-purpose I/O / peripheral function |
| Pin produk AA4 | PC22 — General-purpose I/O / peripheral function |
| Pin produk AA5 | PC23 — General-purpose I/O / peripheral function |
| Pin produk AA6 | VSS — Ground |
| Pin produk AB1 | VDDCORE — Core voltage (1.2 V regulated internally) |
| Pin produk AB2 | PC24 — General-purpose I/O / peripheral function |
| Pin produk AB3 | PC25 — General-purpose I/O / peripheral function |
| Pin produk AB4 | PC26 — General-purpose I/O / peripheral function |
| Pin produk AB5 | PC27 — General-purpose I/O / peripheral function |
| Pin produk AB6 | VDDCORE — Core voltage (1.2 V regulated internally) |
| Pin produk AC1 | VSS — Ground |
| Pin produk AC2 | PC28 — General-purpose I/O / peripheral function |
| Pin produk AC3 | PC29 — General-purpose I/O / peripheral function |
| Pin produk AC4 | PC30 — General-purpose I/O / peripheral function |
| Pin produk AC5 | PC31 — General-purpose I/O / peripheral function |
| Pin produk AC6 | VSS — Ground |
| Pin produk AD1 | VDDIO — I/O supply voltage (3.3 V typical) |
| Pin produk AD2 | PD0 — General-purpose I/O / peripheral function |
| Pin produk AD3 | PD1 — General-purpose I/O / peripheral function |
| Pin produk AD4 | PD2 — General-purpose I/O / peripheral function |
| Pin produk AD5 | PD3 — General-purpose I/O / peripheral function |
| Pin produk AD6 | VDDIO — I/O supply voltage (3.3 V typical) |
| Pin produk AE1 | VSS — Ground |
| Pin produk AE2 | PD4 — General-purpose I/O / peripheral function |
| Pin produk AE3 | PD5 — General-purpose I/O / peripheral function |
| Pin produk AE4 | PD6 — General-purpose I/O / peripheral function |
| Pin produk AE5 | PD7 — General-purpose I/O / peripheral function |
| Pin produk AE6 | VSS — Ground |
| Pin produk AF1 | VDDCORE — Core voltage (1.2 V regulated internally) |
| Pin produk AF2 | PD8 — General-purpose I/O / peripheral function |
| Pin produk AF3 | PD9 — General-purpose I/O / peripheral function |
| Pin produk AF4 | PD10 — General-purpose I/O / peripheral function |
| Pin produk AF5 | PD11 — General-purpose I/O / peripheral function |
| Pin produk AF6 | VDDCORE — Core voltage (1.2 V regulated internally) |
| Pin produk AG1 | VSS — Ground |
| Pin produk AG2 | PD12 — General-purpose I/O / peripheral function |
| Pin produk AG3 | PD13 — General-purpose I/O / peripheral function |
| Pin produk AG4 | PD14 — General-purpose I/O / peripheral function |
| Pin produk AG5 | PD15 — General-purpose I/O / peripheral function |
| Pin produk AG6 | VSS — Ground |
| Pin produk AH1 | VDDIO — I/O supply voltage (3.3 V typical) |
| Pin produk AH2 | PD16 — General-purpose I/O / peripheral function |
| Pin produk AH3 | PD17 — General-purpose I/O / peripheral function |
| Pin produk AH4 | PD18 — General-purpose I/O / peripheral function |
| Pin produk AH5 | PD19 — General-purpose I/O / peripheral function |
| Pin produk AH6 | VDDIO — I/O supply voltage (3.3 V typical) |
| Pin produk AI1 | VSS — Ground |
| Pin produk AI2 | PD20 — General-purpose I/O / peripheral function |
| Pin produk AI3 | PD21 — General-purpose I/O / peripheral function |
| Pin produk AI4 | PD22 — General-purpose I/O / peripheral function |
| Pin produk AI5 | PD23 — General-purpose I/O / peripheral function |
| Pin produk AI6 | VSS — Ground |
Aplikasi Umum
ATSAME70Q19A-CFN cocok untuk 6 aplikasis: Industrial Motor Control (FOC / PMSM / BLDC), Industrial IoT Edge Gateway with Ethernet, Automotive Body Electronics Gateway, Audio Playback and Voice Processing, Human-Machine Interface (HMI) with TFT LCD, Connected Sensor Hub / Data Concentrator.
Industrial Motor Control (FOC / PMSM / BLDC)
The ATSAME70Q19A-CFN fits field-oriented control (FOC) of PMSM, BLDC, and stepper motors thanks to its 300 MHz Cortex-M7 core with single-precision FPU and DSP extensions. The 1500 CoreMark headroom sustains a 20 kHz current-control loop plus space-vector PWM generation with margin for sensorless observers and active disturbance rejection. Its 12-bit 2 MSPS ADC samples three shunt currents simultaneously within 1 us, and the PWM peripheral supports complementary outputs with 8 ns dead-time insertion - critical for safe three-phase inverter switching. Compared to a Cortex-M4F solution, the M7 doubles the instruction throughput per cycle, enabling higher RPM torque bandwidth.
Direkomendasikan
Industrial IoT Edge Gateway with Ethernet
The ATSAME70Q19A-CFN is purpose-built for industrial IoT edge gateways because it integrates a 10/100 Ethernet MAC with IEEE 1588 PTP hardware timestamping alongside dual CAN-FD controllers, six USARTs, and five TWI (I2C) buses. The 300 MHz Cortex-M7 runs an embedded TCP/IP stack (lwIP or Harmony 3 NET) plus MQTT/Sparkplug-B and OPC UA pub-sub with headroom for TLS 1.3 using the on-chip AES and SHA accelerators. The 256 KB SRAM accommodates TLS session buffers without external memory. PTP synchronization to sub-microsecond accuracy enables coordinated multi-axis motion control across a factory floor.
Direkomendasikan
Automotive Body Electronics Gateway
The ATSAME70Q19A-CFN's dual CAN-FD controllers support modern automotive body networks (CAN 2.0 and ISO 11898-1 CAN-FD), while the Ethernet MAC bridges to automotive Ethernet backbones. The 300 MHz Cortex-M7 performs CAN message routing and protocol translation (UDS, OBD-II) with sub-millisecond latency. Hardware AES-256 accelerates secure diagnostics (SecOC) without CPU load. While the industrial-grade -85C rating fits cabin modules, body controllers targeting under-hood or AEC-Q100 environments should pair with the SAM V71/V70 family, which is the AEC-Q100-qualified counterpart of the SAME70 platform.
Direkomendasikan
Audio Playback and Voice Processing
The ATSAME70Q19A-CFN delivers Cortex-M7 DSP horsepower adequate for real-time audio decoding (MP3, AAC, Opus) and voice front-end processing (AEC, beamforming, noise suppression). The integrated I2S peripheral streams stereo audio at up to 192 kHz sample rate, and the Cortex-M7's SIMD instructions accelerate FFT-based algorithms at >10x the speed of Cortex-M4. The 256 KB SRAM holds 10 seconds of 48 kHz stereo audio buffer or 64-tap FIR filter coefficients with headroom. Compared to a discrete DSP, the SAME70 eliminates the inter-IC latency and BOM cost.
Direkomendasikan
Human-Machine Interface (HMI) with TFT LCD
The ATSAME70Q19A-CFN integrates a 2D graphics accelerator (GFXMMU) and a TFT LCD controller, enabling direct drive of displays up to WVGA (800x480) without external GPU. Combined with the 300 MHz Cortex-M7, it runs Microchip's Harmony 3 graphics library for smooth LVGL/Mosaic object rendering. The Image Sensor Interface (ISI) adds camera input capability, supporting machine-vision HMIs (e.g., biometric kiosks). The 144-ball UFBGA package provides sufficient GPIO for capacitive touch I2C bridges and backlight PWM control.
Direkomendasikan
Connected Sensor Hub / Data Concentrator
The ATSAME70Q19A-CFN aggregates data from multiple sensors (SPI ADC, I2C environmental sensors, UART GPS, CAN-FD vehicle bus) and publishes over Ethernet or USB. The dual 16-channel DMA controllers and Peripheral Event System enable sensor polling without CPU intervention, while the Cortex-M7 performs local FFT analysis for vibration monitoring and predictive maintenance. The 12-bit 2 MSPS ADC samples vibration transducers at >100 kHz, and the 256 KB SRAM buffers FFT windows before transmission. Hardware SHA-256 authenticates sensor data for tamper detection in industrial settings.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk ATSAME70Q19A-CFN — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | ATSAME70Q19B-CFN | ATSAMS70Q21A-CFN | ATSAMS70Q20B-CFNT | ATSAME70Q19A-CFNT | ATSAME70Q21A-CFN |
|---|---|---|---|---|---|---|
| Package | 144-ball UFBGA (6x6 mm) | 144-ball UFBGA (6x6 mm) - same | 144-ball UFBGA (6x6 mm) - same | 144-ball UFBGA (6x6 mm) - same | 144-ball UFBGA (6x6 mm) - same | 144-ball UFBGA (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU |
| Maximum Clock Frequency | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Flash Memory | 512 KB | 512 KB | 2048 KB | 2048 KB | 512 KB | 2048 KB |
| SRAM | 256 KB | 256 KB | 384 KB | 384 KB | 256 KB | 384 KB |
| Ethernet MAC | 10/100 with 1588 PTP | 10/100 with 1588 PTP | 10/100 with 1588 PTP | Not present | 10/100 with 1588 PTP | 10/100 with 1588 PTP |
| CAN-FD Controllers | 2 | 2 | 2 | 2 | 2 | 2 |
| Silicon Revision | Rev A | Rev B (with errata fixes) | Rev A | Rev B | Rev A | Rev A |
Diferensiator Kunci
- Highest single-core performance in the SAM E70 family at 300 MHz Cortex-M7 (vsATSAME54P20A-AFT)
- Integrated 10/100 Ethernet MAC with hardware 1588 PTP timestamp (vsATSAMS70Q20B-CFNT)
- Silicon revision A availability for legacy firmware compatibility (vsATSAME70Q19B-CFN)
Catatan Desain
The ATSAME70Q19A-CFN's 144-ball UFBGA uses a 0.4 mm ball pitch. Plan your PCB stack-up for microvia-in-pad technology: laser-drilled microvias (typically 0.1 mm diameter) from each ball pad to an inner signal layer are required to route signals out of the dense ball grid. Standard 0.3 mm mechanical-drilled vias cannot fit between balls. Plan at least a 4-layer stack-up with one full ground plane beneath the package for signal integrity and thermal dissipation. Estimated: cost adder for microvia PCB vs standard through-hole PCB is approximately 30-50% on prototypes.
Decoupling per the SAME70 reference schematic: place a 100 nF X7R 0402 ceramic on every VDDIO/VDDCORE ball as close as possible (target <1 mm trace length), one 4.7 uF X5R bulk on VDDIN within 5 mm of the package, and a 10 uF + 100 nF pair on VDDCORE. The Cortex-M7 core's high-frequency switching (300 MHz) generates sub-nanosecond current spikes; inadequate decoupling causes code-fetch failures and random watchdog resets. The internal 1.2 V LDO powering VDDCORE requires a minimum 1 uF output capacitor - do not omit.
At maximum CPU activity (300 MHz, all peripherals active), the ATSAME70Q19A-CFN dissipates approximately 0.5-0.8 W depending on I/O loading and GPIO toggle rate. The 6x6 mm UFBGA package has theta_JA around 25-30 C/W on a 4-layer JEDEC test board. The package thermal performance depends critically on the PCB copper area under the exposed die attach pad - flood the inner ground plane directly under the package for best heat spreading. Estimated: without copper flooding, junction temperature can rise 20-25 C above ambient at full load.
Common pitfalls with the ATSAME70Q19A-CFN: (1) Mistakenly configuring the Cortex-M7 ITCM/DTCM sizes can lock the debugger out - always keep at least 32 KB of system SRAM for Harmony 3 stacks; (2) The CAN-FD peripheral requires explicit configuration of the peripheral clock (PCK6) before CAN transceivers will see a baud-rate output; (3) The USB OTG peripheral requires external 5 V VBUS detection circuit - the internal comparators do not handle 5 V directly; (4) BGA rework without a proper BGA rework station leads to bridging - consider pre-baking at 125 C for 24 hours per IPC/JEDEC J-STD-033 before assembly.
Informasi Konformitas
RoHS and REACH compliant per Microchip product declaration. Not AEC-Q100 qualified - for automotive under-hood designs consider the SAM V71/V70 family which carries AEC-Q100 Grade 1. Lead-free matte-tin UFBGA balls. Halogen-free per IEC 61249-2-21.