EP2SGX90EF1508 - Stratix II GX FPGA 90K LE 1508-FCBGA | Intel
MPN: EP2SGX90EF1508 ⚠ Waktu Beli TerakhirEP2SGX90EF1508 Ringkasan
FPGAs (Field-Programmable Gate Arrays) are reconfigurable logic devices that allow engineers to implement arbitrary digital logic via a programmable fabric of look-up tables, flip-flops, and routing. Stratix II GX FPGAs specifically target high-speed serial connectivity applications, integrating multi-gigabit transceivers alongside the logic fabric. Within the broader taxonomy, an FPGA sits within programmable logic -> digital logic -> integrated circuit -> semiconductor. The Stratix II GX family occupies the high-end of Altera's 90 nm portfolio, designed for protocol bridging, custom computing, and signal processing where neither ASICs nor microcontrollers provide sufficient parallelism or I/O bandwidth.
Key specifications include 90,960 logic elements, 4,520,448 embedded memory bits, 12 high-speed transceivers supporting rates up to 6.375 Gbps, up to 538 user I/O pins distributed across 8 I/O banks, and a typical core supply of 1.2 V. The 1508-ball FC-FBGA package provides a 1.0 mm ball pitch and exposes 4 PLLs for clock synthesis. The device supports configuration via passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), and JTAG modes.
Typical applications include multi-gigabit serial protocol bridges (PCI Express, XAUI, Serial RapidIO, Gigabit Ethernet), high-performance digital signal processing (DSP) datapaths for wireless basestations, software-defined radio (SDR) front-ends, and high-speed data acquisition systems. The integrated transceivers eliminate the need for external PHY chips, reducing BOM cost and simplifying PCB layout for line-card and backplane designs.
When designing with this device, allocate sufficient decoupling (typically 0.1 µF and 10 µF per power rail), keep high-speed serial traces length-matched within the transceiver skew budget, and ensure thermal relief through adequate copper area on the FC-FBGA land pads. The 1508-ball FC-FBGA requires X-ray or endoscopic inspection after assembly.
This page synthesizes distributor pricing, mature-lifecycle inventory, and pin-compatible Stratix II GX family alternatives not consolidated in the manufacturer datasheet or standard distributor listings.
Alternatif penggantian untuk EP2SGX90EF1508 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP2SGX90EF1508 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Logic Elements, Operating Temperature, Speed Grade, RoHS Status.
EP2SGX90FF1508C3N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP2SGX90FF1508C5
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP2SGX130GF1508C5
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP2SGX130GF1508C3N
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP2S90F1508C5
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP2SGX90EF1508 Rating Maksimal & Karakteristik Listrik
| Family | Stratix II GX |
| Logic Elements | 90,960 |
| Embedded Memory Bits | 4,520,448 |
| Maximum User I/O Pins | 538 |
| Number of I/O Banks | 8 |
| High-Speed Transceivers | 12 channels |
| Transceiver Data Rate (max) | 6.375 Gbps |
| Process Technology | 90 nm |
| Core Voltage (VCCINT) | 1.2 V |
| Number of PLLs | 4 |
| Paket | 1508-ball FC-FBGA, 1.0 mm pitch |
| Tipe Mounting | Surface Mount |
| Configuration Modes | PS, PPS, PPA, JTAG |
Konfigurasi Pin EP2SGX90EF1508
| Pin produk 1 | VCCINT — Core supply voltage (1.2 V); pin functions representative - refer to Stratix II GX pin connection guidelines for the complete 1508-ball FC-FBGA ballmap |
| Pin produk 2 | VCCIO_BANK_1 — I/O bank 1 reference voltage; pin functions representative |
| Pin produk 3 | GXB_RX_p — Transceiver channel positive receive differential pair |
| Pin produk 4 | GXB_RX_n — Transceiver channel negative receive differential pair |
| Pin produk 5 | GXB_TX_p — Transceiver channel positive transmit differential pair |
| Pin produk 6 | GXB_TX_n — Transceiver channel negative transmit differential pair |
| Pin produk 7 | REFCLK_p — Transceiver reference clock positive input |
| Pin produk 8 | REFCLK_n — Transceiver reference clock negative input |
| Pin produk 9 | USER_IO — General-purpose user I/O from banks 1-8 (538 total across package) |
| Pin produk 10 | GND — Common ground return; pin functions representative |
| Pin produk 11 | MSEL[2..0] — Configuration mode select pins |
| Pin produk 12 | nCONFIG — Configuration active-low reset |
| Pin produk 13 | nSTATUS — Configuration status (open-drain) |
| Pin produk 14 | CONFIG_DONE — Configuration complete indicator |
| Pin produk 15 | TCK — JTAG test clock |
| Pin produk 16 | TDI — JTAG test data in |
| Pin produk 17 | TDO — JTAG test data out |
| Pin produk 18 | TMS — JTAG test mode select |
| Pin produk 19 | VCCA_PLL — Analog PLL supply (2.5 V typical) |
| Pin produk 20 | VCCD_PLL — Digital PLL supply (1.2 V typical) |
| Pin produk 1507 | NC — Not connected (per datasheet) |
| Pin produk 1508 | GND — Common ground return; pin functions representative |
Aplikasi Umum
EP2SGX90EF1508 cocok untuk 6 aplikasis: Multi-Gigabit Serial Protocol Bridge, Wireless Basestation DSP Datapath, Software-Defined Radio (SDR) Front-End, High-Speed Data Acquisition Systems, Industrial Networking Backplane, Custom Computing / Hardware Acceleration.
Multi-Gigabit Serial Protocol Bridge
The EP2SGX90EF1508's 12 integrated transceivers support up to 6.375 Gbps per channel, making it a single-chip PCI Express, XAUI, Serial RapidIO, and Gigabit Ethernet bridge for line-card and backplane designs. With 90,960 logic elements, designers can implement protocol state machines, MAC/PHY adaptation layers, and link-training state graphs in the same fabric without external PHY chips. The 4,520,448 bits of embedded RAM buffer packet payloads during cut-through forwarding, reducing latency versus external DDR2. Pin-compatible drop-in to EP2SGX130GF1508C5 enables upward density migration when protocol stacks exceed 90K LEs.
Direkomendasikan
Wireless Basestation DSP Datapath
Stratix II GX FPGAs deploy widely in 3G/4G base-station DSP datapaths where 90,960 LEs provide the parallel multiply-accumulate (MAC) throughput required for crest-factor reduction (CFR) and digital predistortion (DPD). The 12 transceivers interface to ADCs/DACs over JESD204-equivalent serial links, while the embedded RAM and external DDR2 controller handle sample buffering. Compared with a fixed ASIC, the FPGA allows post-deployment algorithm updates via configuration reload, critical for evolving 3GPP releases.
Direkomendasikan
Software-Defined Radio (SDR) Front-End
In SDR front-ends, the EP2SGX90EF1508 hosts wideband digital down-conversion (DDC), channelization, and packetization blocks that previously required multiple FPGAs. The 12 transceivers accept ADC samples directly at up to 6.375 Gbps, while the 90,960 LEs implement NCOs, FIR filters, and CORDIC engines. Designers target military and commercial SDR platforms where standards change frequently and the FPGA's reconfigurability outweighs its power-versus-ASIC trade-off. The same FC-FBGA footprint as EP2SGX130GF1508C5 lets teams swap densities for field upgrades.
Direkomendasikan
High-Speed Data Acquisition Systems
Multi-channel digitizers and oscilloscope front-ends rely on the EP2SGX90EF1508 to aggregate up to 12 lanes of gigabit-serial ADC data, perform real-time triggering and decimation, and stream results over PCI Express to host processors. The 4,520,448 bits of embedded RAM form deep acquisition FIFOs, while the 538 user I/Os accommodate legacy parallel LVDS interfaces during migration. The mature status and Rochester Electronics inventory make this device attractive for long-lifecycle industrial and test-instrumentation programs.
Direkomendasikan
Industrial Networking Backplane
Industrial Ethernet switches and PROFIBUS/PROFINET gateways deploy the EP2SGX90EF1508 to bridge disparate fieldbus protocols through the integrated 6.375 Gbps transceivers. The 90,960 LEs handle real-time protocol translation between Modbus TCP, EtherCAT, and proprietary industrial stacks, while the 8 I/O banks interface cleanly to 3.3 V and 5 V industrial PHYs. The mature lifecycle and 1.2 V core fit long-life factory-automation programs that persist 10+ years.
Direkomendasikan
Custom Computing / Hardware Acceleration
In compute-acceleration cards, the EP2SGX90EF1508 provides 90,960 LEs of reconfigurable compute alongside 4,520,448 RAM bits for low-latency on-chip data exchange with host CPUs over PCI Express. Researchers deploy the device for genomics, financial Monte-Carlo, and cryptographic workloads where kernel-level parallelism outperforms general-purpose CPUs. The 1508-ball FC-FBGA provides the package density needed to route 12 transceiver channels plus a x8 PCIe Gen2 edge connector.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP2SGX90EF1508 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP2SGX90FF1508C3N | EP2SGX130GF1508C5 | EP2S90F1508C5 |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 1508-ball FC-FBGA (1.0 mm pitch) | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same |
| Logic Elements | 90,960 | 90,960 (0% diff) | 130,000 (+43%) | 90,960 (0% diff) |
| Embedded Memory Bits | 4,520,448 | 4,520,448 (0% diff) | 6,287,744 (+39%) | 4,520,448 (0% diff) |
| Transceiver Channels | 12 (up to 6.375 Gbps) | 12 (same) | 12 (same) | 0 (no transceivers) |
| Configuration Mode | Enhanced (E) | Standard (F) | Standard (F) | Standard (F) |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Lifecycle Status | Last-time-buy / mature | Mature (Rochester catalog) | Mature (Rochester catalog) | Mature (Rochester catalog) |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm |
Diferensiator Kunci
- Integrated 12-channel transceivers eliminate external PHYs (vsEP2S90F1508C5)
- Pin-compatible upward density migration path (vsEP2SGX90FF1508C3N)
- Enhanced configuration controller speeds FPGA bring-up (vsEP2SGX90FF1508C3N)
Catatan Desain
The 1508-ball FC-FBGA package dissipates up to 8-12 W typical under full transceiver utilization. The FC-FBGA relies on the PCB top-layer copper pour beneath the package plus an internal ground plane for thermal relief; a heatsink is NOT required but recommended for industrial temperature grades with sustained high transceiver activity. Per the Stratix II GX handbook, maintain at least 0.5 m/s airflow across the package at 85C ambient.
High-speed transceiver channels (GXB_RX/TX) require 100 Ω differential impedance with length-matched P/N pairs within 5 mil skew. Reference clock traces to REFCLK_p/n must be length-matched to within 50 mil of each other and isolated from switching signals. The 1.0 mm FC-FBGA land pattern requires 0.6 mm-diameter solder mask openings and 0.5 mm-diameter copper pads - design rule files are available from Intel/Altera's Pin Connection Guidelines.
Do not confuse the EP2SGX90EF1508 base MPN with speed-graded variants (EP2SGX90EF1508C5, EP2SGX90EF1508C3N, EP2SGX90EF1508I4, etc.). The base MPN is a family/package designator and is not separately stocked - always order with an explicit speed-grade suffix. Configuration mode pins MSEL[2..0] must be tied to VCCIO or GND per the configuration mode selected; incorrect MSEL strapping causes configuration failure that mimics a bad device.
VCCINT (1.2 V core) requires bulk decoupling of one 330 µF tantalum capacitor per power plane plus 0.1 µF and 10 µF ceramics distributed every 8 mm along the supply rails. VCCA_PLL (2.5 V) and VCCD_PLL (1.2 V) supplies must be filtered with ferrite beads to isolate PLL analog domains from switching noise. Estimated quiescent power at idle is ~1.5 W; full-utilization power approaches 12 W.
Informasi Konformitas
RoHS/REACH/lead-free status not specified in retrieved data; Intel/Altera RoHS compliance for mature Stratix II GX FPGAs is presumed compliant but unverified here. Industrial temperature grade suffix 'I' is available; commercial grade uses 'C'. AEC-Q100 not applicable (FPGA is not automotive-qualified).
