EP4CE15F23C8 - Cyclone IV E FPGA, 15K LE, 484-FBGA | Intel
MPN: EP4CE15F23C8 ✓ AktifEP4CE15F23C8 Ringkasan
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device whose logic function is defined by customer-supplied configuration bitstreams rather than mask lithography. Cyclone IV E sits in the low-power, low-cost tier of the Cyclone IV family (E for Enhanced logic, no transceivers), positioned between MAX/CPLDs and mid-range FPGAs such as Cyclone 10 LP. It targets systems needing tens of thousands of logic elements with LVDS, DDR2, and parallel memory interfaces but without multi-gigabit transceivers.
Key features of the EP4CE15F23C8 include 343 dedicated 18x18 hardware multipliers (~ 2.7 GMACs DSP throughput when fully utilized), 4 PLLs for clock synthesis and skew management, 8 dedicated clock networks, 343 Kbits of M9K embedded memory blocks distributed across the fabric, and up to 343 user I/O pins (343 / 343 in the F23 package). The device supports LVDS Tx/Rx at up to 840 Mbps, DDR2 SDRAM interfaces up to 200 MHz, and configuration via JTAG, AS, PS, and FPP modes.
Architecturally, Cyclone IV E uses a 60 nm process with a 1.2 V core supply, achieving static power roughly 40 % lower than the prior Cyclone III generation. The fabric is built from logic array blocks (LABs) of 16 logic elements each, with routing optimized for short interconnects. I/O banks support a wide range of standards (LVTTL, LVCMOS, PCI, PCI-X, SSTL, HSTL, LVDS) with programmable drive strength and slew rate, simplifying board integration.
Typical applications include motor control and industrial automation backplanes, video surveillance image processing, low-cost protocol bridging (PCI-to-PCIe, UART to I2S), LED display controllers, and machine vision front-ends. The Cyclone IV family is also commonly seen as a glue-logic replacement for aging CPLDs in 3.3 V mixed-signal boards.
Designers should plan thermal dissipation: at full DSP utilization the EP4CE15F23C8 can dissipate ~ 1.5 W, requiring thermal vias under the F23 BGA. The Quartus II / Quartus Prime design suite (Web Edition, free) is the supported toolchain for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, same-family Cyclone IV drop-in alternatives, and practical design notes that extend the manufacturer datasheet's typical-application content.
Alternatif penggantian untuk EP4CE15F23C8 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP4CE15F23C8 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Configuration Modes, Embedded Multipliers (18x18), Logic Elements, Operating Temperature.
EP4CE15F23C8N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP4CE15F23I7N
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EP4CE15F23A7N
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EP4CE30F23C8N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP4CE30F23C7N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP4CE15F23C8 Rating Maksimal & Karakteristik Listrik
| Family | Cyclone IV E |
| Device | EP4CE15 |
| Logic Elements (LE) | 15,408 |
| Embedded Memory (bits) | 516,096 |
| M9K Memory Blocks | 112 |
| Embedded Multipliers (18x18) | 112 |
| User I/O Pins (max) | 343 |
| PLLs | 4 |
| Global Clock Networks | 8 |
| Paket | 484-FBGA (F23, 23x23 mm, 1.0 mm pitch) |
| Core Voltage | 1.2 V |
| Suhu Kerja | 0 C to +85 C (commercial, C8 speed grade) |
| Speed Grade | 8 (C8 = commercial, -8 speed) |
| Configuration Modes | JTAG, AS, PS, FPP |
| Status RoHS | Compliant |
| Process Technology | 60 nm low-power |
| LVDS Data Rate (max) | 840 Mbps |
EP4CE15F23C8 484-fbga (f23, 23x23 mm, 1.0 mm pitch) Diamant Konfigurasi Panduan
Konfigurasi pin untuk EP4CE15F23C8 (484-fbga (f23, 23x23 mm, 1.0 mm pitch) pakai pakai). IC digital ini termasuk GPIO, antarmuka komunikasi (UART, SPI, I2C), dan pin kuasa. Lihat datasheet produsen untuk fungsi pin alternatif dan opsi konfigurasi. Penting untuk desain sistem pengemasan dan PCB.
Tidak ada data diatribut pin yang tersedia untuk EP4CE15F23C8.
Lihat ke: datasheet produk untuk konfigurasi pin penuh.
Aplikasi Umum
EP4CE15F23C8 cocok untuk 7 aplikasis: Industrial Motor Control and Automation, Video Surveillance Image Pipeline, Protocol Bridging and Interface Conversion, LED Display and Video Wall Controllers, Machine Vision Front-End Pre-Processing, Industrial Test and Measurement Backplane, Cost-Sensitive ASIC Replacement in Consumer Devices.
Industrial Motor Control and Automation
The EP4CE15F23C8's 112 18x18 multipliers and 343 Kbits of M9K memory make it well-suited for field-oriented control (FOC) loops in three-phase motor drives. With a 100 MHz system clock the DSP blocks deliver 2.0+ GMACs sustained throughput - enough for sensorless FOC on PMSM motors at 50 kHz loop rates. Its commercial 0 to +85 C grade fits sealed control cabinets with forced convection, and the 343 user I/Os accept multi-axis encoder feedback (QEP, SSI, EnDat) plus fault inputs. Quartus Prime SOPC Builder can add Nios II soft-core CPUs for CANopen / EtherCAT slave stacks. Designers should isolate the FPGA's switching noise from analog current-sense amplifiers using a separate 3.3 V analog LDO on the board.
Direkomendasikan
Video Surveillance Image Pipeline
The EP4CE15F23C8 is widely used as a cost-effective image-processing pipeline for 1080p60 video surveillance. The 112 hardware multipliers handle real-time 2D FIR filters, motion detection (SAD/SATD), and H.264 baseline encoding at D1 resolution. M9K memory blocks implement dual-line buffers for Sobel-edge or Laplacian-of-Gaussian kernels without external SRAM. The 343 LVDS-capable I/Os directly interface to HDMI/DVI serializers such as the ADV7513, while the four PLLs regenerate 148.5 MHz pixel clocks. Compared with DSP processors, the FPGA delivers deterministic latency for synchronous multi-channel analytics.
Direkomendasikan
Protocol Bridging and Interface Conversion
The 343 user I/O pins and rich SERDES-less LVDS make the EP4CE15F23C8 a flexible glue-logic replacement for legacy parallel-to-serial bridges. Common applications include PCI-X to PCIe Gen1 fan-out, UART/I2C/SPI to USB host conversion (paired with CY7C67300 or FX2LP), and parallel camera (DVP) to MIPI-CSI translation. The 112 DSP blocks accelerate CRC, AES-128, or custom scrambling required in industrial gateways. The 1.2 V core plus 2.5/3.3 V I/O banks simplify mixed-voltage bridges without level shifters. Quartus SOPC's QSYS toolchains port existing 8051 / Nios II firmware to drop into bridging designs.
Direkomendasikan
LED Display and Video Wall Controllers
Large LED video walls require high-bandwidth pixel refresh - typically 60 Hz with 16-bit color at 1920x1080 per panel - which the EP4CE15F23C8 handles comfortably. Its 112 multipliers implement gamma correction, color-space conversion (RGB to YCbCr), and pixel-level brightness mapping in real time. The 516 Kbits of M9K memory buffers 2-3 scan-line strips, while the 343 LVDS pairs drive multiple HUB75 panels simultaneously over long-distance differential pairs. The 4 PLLs generate pixel clocks from a single low-cost 27 MHz crystal, and the JTAG chain lets integrators update panel mappings in the field without removing the FPGA.
Direkomendasikan
Machine Vision Front-End Pre-Processing
Pre-processing stages of machine vision systems - shading correction, lens distortion removal, Bayer demosaicing, and feature extraction - map naturally to the EP4CE15F23C8's fabric. The 18x18 multipliers execute 5x5 and 7x7 convolution kernels at 200 MHz in parallel, sustaining pixel rates above 150 MP/s. M9K blocks implement line buffers and histogram accumulation directly. Sensor interfaces include LVDS sub-LVDS, HiSPi, and parallel DVP up to 16 bits, all supported by the device's I/O bank architecture. The Cyclone IV's mature Quartus toolchain simplifies ISP (image signal processor) IP integration compared with newer families that lack full LVDS support.
Direkomendasikan
Industrial Test and Measurement Backplane
The EP4CE15F23C8 fits test-instrument backplanes that require multi-channel waveform generation, pattern capture, and bus protocol emulation. The four PLLs derive up to 16 phase-aligned clocks from a single TCXO reference for synchronized multi-board sample rates. 112 DSP blocks accelerate FFT / DFT cores for spectrum analysis, while 516 Kbits of embedded memory captures long record snapshots without external SRAM. Its PCI-X host interface lets the FPGA sit directly on PXI / cPCI test backplanes. Commercial 0 to +85 C range suits factory-floor test equipment with controlled airflow, and the Cyclone IV E family's long lifecycle through 2040 ensures test platforms stay supportable for decades.
Direkomendasikan
Cost-Sensitive ASIC Replacement in Consumer Devices
For low-volume consumer products that would otherwise justify a custom ASIC mask (under 50K unit annual volume), the EP4CE15F23C8 offers a reprogrammable alternative. Mid-volume hobbyist 3D printers, semi-professional audio mixers, and prosumer camera controllers often use Cyclone IV E for its 343 GPIO count, low 1.2 V core power (~ 100 mA typical), and free Quartus II Web Edition toolchain. Designers can prototype with multiple firmware A/B revisions stored in two EPCS serial config flash devices. The 60 nm low-power process delivers ~ 40 % lower static power than Cyclone III at the same clock rate, helping thermal envelopes in sealed enclosures.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP4CE15F23C8 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP4CE15F23C8N | EP4CE15F23I7N | EP4CE15F23A7N | EP4CE30F23C8N | EP4CE30F23C7N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA F23 (23x23 mm, 1.0 mm pitch) | 484-FBGA F23 - same | 484-FBGA F23 - same | 484-FBGA F23 - same | 484-FBGA F23 - same | 484-FBGA F23 - same |
| Logic Elements | 15,408 | 15,408 | 15,408 | 15,408 | 29,440 (+91 %) | 29,440 (+91 %) |
| Embedded Memory (bits) | 516,096 | 516,096 | 516,096 | 516,096 | 1,179,648 (+128 %) | 1,179,648 (+128 %) |
| 18x18 Multipliers | 112 | 112 | 112 | 112 | 200 (+78 %) | 200 (+78 %) |
| User I/O (max) | 343 | 343 | 343 | 343 | 343 | 343 |
| Speed Grade | 8 (C8) | 8 (C8) | 7 (faster, I7) | 7 (A7) | 8 (C8) | 7 (C7) |
| Temperature Grade | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Industrial (-40 to +100 C) | Automotive (-40 to +125 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) |
| RoHS / Pb-Free | No (SnPb BGA), RoHS 'N' variant available | RoHS Pb-free (matte Sn) | RoHS Pb-free | RoHS Pb-free | RoHS Pb-free | RoHS Pb-free |
Diferensiator Kunci
- Pin-compatible scaling within same F23 BGA footprint (vsEP4CE30F23C8N)
- Industrial temperature without speed penalty (vsEP4CE15F23I7N)
- Same-family migration path with identical ball map (vsEP4CE15F23A7N)
- RoHS / Pb-free option in identical F23 footprint (vsEP4CE15F23C8N)
Catatan Desain
Estimated: at full DSP utilization the EP4CE15F23C8 in F23 BGA can dissipate 1.3 to 1.6 W (calculated from PowerPlay early estimator for typical 100 MHz designs). The F23 package exposes a thermal-pad array under the die via JTAG / GND balls - designers should stencil a thermal-via array of 0.3 mm plugged-hole vias on 1.0 mm pitch under the package center on both top and bottom layers, stitched to internal ground planes. Without this thermal path the junction temperature can exceed +100 C at 85 C ambient. A small 15 C/W external heatsink is optional but rarely necessary.
The EP4CE15F23C8 requires three rails: VCCINT (1.2 V core), VCCIO (1.2 V to 3.3 V per bank), and VCCA (2.5 V PLL analog). Per the Cyclone IV Device Handbook, VCCA must ramp up before or simultaneously with VCCINT and never remain floating. Recommended decoupling: one 10 uF bulk + four 0.1 uF + one 1 nF per VCCIO bank, and a dedicated pi-filter (ferrite + 10 uF + 0.1 uF) on VCCA from a quiet regulator. Sharing VCCA with a noisy switching VCCIO is a common cause of jitter and PLL lock failures.
The F23 BGA has 1.0 mm ball pitch - escape routing requires 4-layer stackup with 0.075 mm (3 mil) trace width / space microvia stackups. Per Cyclone IV hardware design guidelines, all eight ground balls nearest the die must connect to a solid ground plane on the top layer, with the remaining GND balls stitched to internal ground layers using 8-mil vias. Series termination on all LVDS pairs (100 ohm differential) should be placed within 7 mm of the FPGA balls to avoid reflections above 500 MHz DDR rates.
Three pitfalls commonly seen with EP4CE15F23C8 designs: (1) leaving VCCA floating during power-down - causes latch-up and silent reliability drift; (2) using 'C8' speed grade but targeting Fmax in FPP configuration - the -8 grade frequently fails 100 MHz DDR2 timing closure unless pipelining is redesigned; (3) swapping 'C8' and 'I7N' parts without revalidating timing - the I7N is faster but has wider temperature range, so the design may close timing at -8 commercial but fail at industrial temperatures. Always run MultiCorner timing analysis.
For LVDS Tx/Rx pairs running above 600 Mbps on EP4CE15F23C8, maintain 100 ohm differential impedance with intra-pair skew under 5 ps. Use length-matching within a Quartus Pin Planner constraint of +/- 10 mil. Per Cyclone IV I/O features chapter, DIFFIO pins must be paired on adjacent balls (true LVDS) and routed on the same PCB layer - vias in the middle of a differential pair add 20-40 ps of skew and violate the LVDS mask above 700 Mbps.
Informasi Konformitas
EP4CE15F23C8 uses SnPb BGA finish (not RoHS, not lead-free). The 'N' suffix variant EP4CE15F23C8N is RoHS-compliant and lead-free. AEC-Q100 not qualified for any EP4CE15 variant; use EP4CE15F23A7N for automotive-class temperature range with separate PPAP submission.
