Intel

EPF10K100EQC240-1X - 100K Gate FLEX 10KE FPGA, 240-PQFP | Intel

Name: EPF10K100EQC240-1X - 100K Gate FLEX 10KE FPGA, 240-PQFP | Intel
Brand: Intel
SKU: EPF10K100EQC240-1X

MPN: EPF10K100EQC240-1X ✗ Akhir Hidup

2.375 V to 2.625 V (typ. 2.5 V) Vdss 240-BFQFP / PQFP, 32 x 32 mm Package 333.33 MHz Speed

Ajukan Diskon

MOQ: 1 |

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Kuantitas

EPF10K100EQC240-1X Ringkasan

The Intel (formerly Altera) EPF10K100EQC240-1X is a FLEX 10KE family Field-Programmable Gate Array (FPGA) IC with 100,000 system gates, 4,992 logic cells, 49,152 bits of embedded RAM, and 189 user I/Os, housed in a 240-pin Plastic Quad Flat Pack (PQFP / BFQFP) measuring 32x32 mm. It operates from a 2.5 V core supply (2.375 V to 2.625 V) and supports PCI Local Bus 2.2 compliance for both 3.3 V and 5.0 V signaling, with the -1 speed grade suitable for 33 MHz or 66 MHz PCI designs. The device is built on a 0.22 um CMOS process and is rated for a maximum internal clock frequency of 333.33 MHz.

An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that lets engineers configure arbitrary digital logic after PCB manufacture. FPGAs sit in the broader hierarchy of programmable logic ICs (PLD -> CPLD -> FPGA -> SoC FPGA), and the FLEX 10KE family is positioned as a high-density, SRAM-based FPGA line from Altera with embedded array blocks (EABs) that implement on-chip memory. The 10KE generation followed the original FLEX 10K and added improved I/O standards and faster interconnect, targeting glue-logic replacement, custom datapaths, and pre-ASIC prototyping.

Key features include 624 logic array blocks (LABs), built-in Joint Test Action Group (JTAG) boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990, and embedded array blocks for true dual-port RAM, ROM, and FIFO functions. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, and 5 V tolerant inputs on selected banks. The 'X' suffix indicates the part is supplied in Tray packaging rather than Tape and Reel, and is qualified for commercial operating temperature ranges.

Typical applications include PCI bus interface cards, telecom line cards, industrial motor control, and embedded controller prototyping where mid-density logic and embedded memory are required. SameFrame pin migration across FLEX 10KE PQFP and BGA packages allows designers to move between footprints when scaling density. For new designs, the EPF10K100EQC240-1X is recommended only as a pin-compatible legacy migration source; modern designs should target Cyclone or MAX 10 series devices.

When designing, plan for a 2.5 V core regulator with sufficient headroom and decouple each VCC/GND pair with 0.1 uF and 10 uF capacitors placed close to the package. The PQFP-240 package uses gull-wing leads; a fine-pitch socket is recommended for prototyping, while production boards should use reflow soldering with a peak profile not exceeding 30 s above MSL-3 floor life.

Alternatif penggantian untuk EPF10K100EQC240-1X — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPF10K100EQC240-1X (sama faktor bentuk dan footprint) — berbeda di dalam Family, Package / Case, Speed Grade, Total RAM Bits, Series.

EPF10K100ARC240-1

Altera

Package / Case: 240-BFQFP Exposed Pad (RQFP / HFQFP)

Speed Grade: -1 (fastest FLEX 10KA bin)