Intel

EPF10K20RC208-3 - FLEX 10K FPGA, 20K Gates, 147 I/O, RQFP-208 | Intel

MPN: EPF10K20RC208-3 ✓ Aktif

5.0 V Vdss 208-RQFP (Power Quad Flat Pack) with exposed pad Package 125 MHz Speed

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EPF10K20RC208-3 Ringkasan

The Intel (formerly Altera) EPF10K20RC208-3 is a member of the FLEX 10K family of SRAM-based Field-Programmable Gate Arrays (FPGAs), delivering 20,000 typical gates and 1,152 logic elements in a 208-pin RQFP (Power Quad Flat Pack) package with exposed thermal pad. Speed grade -3 indicates the device is specified for a propagation delay tier suitable for up to 125 MHz internal operation, fabricated on a 5V, 0.42 µm CMOS process with 4-input look-up tables (LUTs) and embedded array blocks (EABs) for on-chip memory. The device provides 147 user I/O pins and 12,288 bits of embedded SRAM for distributed buffering.

An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined after manufacture by the end user. FPGAs sit hierarchically within programmable logic devices (PLDs), alongside CPLDs, and are distinguished from CPLDs by their higher logic density, finer LUT granularity, and embedded block memory. The FLEX 10K family was Altera's first device family to integrate embedded array blocks (EABs) of SRAM memory alongside the logic array, creating a system-on-a-programmable-chip (SOPC) platform.

Key features of the EPF10K20RC208-3 include 144 Logic Array Blocks (LABs) each containing 8 Logic Elements, configurable I/O standards supporting 5V TTL/CMOS interfaces, an in-system programmability (ISP) interface via the serial configuration EPROM, and built-in JTAG boundary-scan test (IEEE 1149.1 BST) support. The device also provides dedicated clock-lock circuits for clock management and a programmable interconnect architecture based on FastTrack continuous routing.

Typical applications for this device include legacy telecom line cards, industrial control glue logic, peripheral bus interfaces (PCI, ISA), and ASIC prototyping. Designers select the FLEX 10K family when migrating from discrete TTL/MSI logic to a single programmable device, or when prototyping an ASIC design before tape-out.

When designing with this part, ensure 5.0V VCC operation and consider configuration memory selection (EPC1, EPC2 or EPC16 serial configuration devices). Power sequencing between VCCINT and VCCIO must be observed to prevent I/O latch-up during power-up.

Alternatif penggantian untuk EPF10K20RC208-3 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPF10K20RC208-3 (sama faktor bentuk dan footprint) — berbeda di dalam Series, Operating Temperature, Speed Grade, Configuration Method, Package.

EPF10K20RC208-3N

Intel

Series: FLEX-10K

Operating Temperature: 0°C to 70°C (Commercial)

Configuration Method: SRAM-based, ByteBlaster/BitBlaster compatible