LPC1822JET100E - 32-bit Cortex-M3 180MHz MCU | NXP
MPN: LPC1822JET100E ✓ AktifLPC1822JET100E Ringkasan
A microcontroller is a semiconductor integrated device containing a processor core, memory, input/output ports, and peripheral functions on one chip. The ARM Cortex-M3 architecture used by the LPC1822JET100E provides a deterministic execution environment with efficient exception handling and extensive peripheral integration. In the product hierarchy, this device is a 32-bit microcontroller, an embedded processing IC, and a member of the NXP LPC18xx family.
The verified distributor information identifies the LPC1822JET100E as an ARM Cortex-M3 MCU operating at up to 180 MHz with 512 KB of flash memory. The 512 KB flash provides room for boot code, application firmware, configuration data, and protocol stacks, while the integrated SRAM supports working memory and data-intensive embedded routines. The 100-TFBGA package exposes a large number of pins for high-speed I/O, communications, storage, and power connections without requiring a large peripheral package.
The LPC1822JET100E is intended for embedded designs that need flexible peripheral access and high-speed serial connectivity. Its architecture can support industrial controllers, network-connected equipment, data acquisition systems, and communication gateways. Software development is based on the ARM Cortex-M3 ecosystem, allowing engineers to use compatible C toolchains, debugging tools, and embedded middleware. The NXP product page provides the official data sheet and part information for design decisions.
Typical implementation places the microcontroller at the center of a control board, connecting sensors through GPIO and serial interfaces, driving external nonvolatile storage, and communicating through Ethernet, USB, or other available peripherals. Firmware should initialize clocks, pin multiplexing, memory, and only the required peripherals to reduce power consumption and simplify system validation. The exact peripheral configuration, electrical limits, and package pin assignments must be confirmed in the NXP manufacturer datasheet.
Designers should verify the 100-TFBGA land pattern, exposed-pad requirements, power rails, decoupling, flash programming, and signal-integrity margins directly against the manufacturer documentation. A 180 MHz processor also requires careful clock, trace, return-path, and electromagnetic-compatibility layout. Because the verified data confirms the core frequency, flash size, package, and function, but does not provide the complete electrical tables, detailed pin map, or pricing tiers, those missing values are explicitly marked rather than inferred.
This product page consolidates verified distributor specifications, an official NXP source, package information, selection guidance, and practical design cautions into a single engineering-oriented reference for engineers evaluating the LPC1822JET100E.
Alternatif penggantian untuk LPC1822JET100E — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian LPC1822JET100E (sama faktor bentuk dan footprint) — berbeda di dalam Package, Product Type, Architecture, Flash Memory, Flash Organization.
LPC1813JET100E
✅ Drop-InKontak untuk harga
Lihat Datasheet →LPC1815JET100E
✅ Drop-InKontak untuk harga
Lihat Datasheet →LPC1823JET100E
✅ Drop-InKontak untuk harga
Lihat Datasheet →LPC1827JET100E
✅ Drop-InKontak untuk harga
Lihat Datasheet →LPC1812JET100E
✅ Drop-InKontak untuk harga
Lihat Datasheet →LPC1822JET100E Rating Maksimal & Karakteristik Listrik
| Product Type | 32-bit ARM Cortex-M3 microcontroller |
| Processor Core | ARM Cortex-M3 |
| Maximum CPU Frequency | 180 MHz |
| Flash Memory | 512 KB (512K x 8) |
| Architecture | 32-bit |
| Paket | 100-TFBGA (9 mm x 9 mm) |
| Tipe Mounting | Surface mount |
| Status RoHS | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | unknown |
| Lead-Free Status | unknown |
| Halogen-Free Status | unknown |
LPC1822JET100E 100-tfbga (9 mm x 9 mm) Diamant Konfigurasi Panduan
Konfigurasi pin untuk LPC1822JET100E (100-tfbga (9 mm x 9 mm) pakai pakai). IC digital ini termasuk GPIO, antarmuka komunikasi (UART, SPI, I2C), dan pin kuasa. Lihat datasheet produsen untuk fungsi pin alternatif dan opsi konfigurasi. Penting untuk desain sistem pengemasan dan PCB.
Tidak ada data diatribut pin yang tersedia untuk LPC1822JET100E.
Lihat ke: datasheet produk untuk konfigurasi pin penuh.
Aplikasi Umum
LPC1822JET100E cocok untuk 6 aplikasis: Industrial Control System, Networked Data Acquisition, Communication Gateway, USB-C Device Controller, Precision Sensor Hub, Audio and Display Interface.
Industrial Control System
The LPC1822JET100E fits centralized industrial controllers that require deterministic real-time behavior, a 32-bit ARM Cortex-M3 core, and 180 MHz processing performance. Its confirmed 512 KB flash can hold control firmware, configuration data, and diagnostic routines. The 100-TFBGA package provides 100 balls for sensor inputs, actuator outputs, communications, and power distribution. A production design should verify the required peripheral set, memory limits, voltage range, and temperature grade in the NXP data sheet before final qualification.
Direkomendasikan
Networked Data Acquisition
The LPC1822JET100E is appropriate for acquisition and gateway equipment that samples sensor data, performs local filtering, and forwards results through a serial or network link. The 180 MHz Cortex-M3 core provides more processing headroom than a basic microcontroller, while 512 KB flash supports embedded protocols and application code. Its 100-TFBGA footprint exposes numerous signal options, but designers must confirm the exact Ethernet, USB, ADC, timer, and DMA resources available on this device before assigning interfaces.
Direkomendasikan
Communication Gateway
A communication gateway can use the LPC1822JET100E to bridge local serial devices to a higher-speed uplink because the device combines a 180 MHz processor with 512 KB of embedded flash in a compact 100-TFBGA package. Firmware can maintain protocol translation, buffering, status reporting, and remote management functions within one controller. The verified snippets associate the LPC18xx family with Ethernet and USB capabilities, but the exact enabled interfaces, pin multiplexing, transceiver requirements, and timing must be confirmed against the manufacturer documentation.
Direkomendasikan
USB-C Device Controller
The LPC1822JET100E can be considered for USB-enabled embedded products that need a 180 MHz ARM Cortex-M3 processor and 512 KB firmware storage. Its high-pin-count package can support multiple low-speed communications and control signals when the required USB controller is present and properly configured. A practical implementation also needs connector protection, routing-continent control, impedance-controlled USB traces, firmware support, and a correctly sized 100-TFBGA land pattern; these details require validation against the NXP package data.
Direkomendasikan
Precision Sensor Hub
The LPC1822JET100E is suitable for a local sensor-hub architecture in which an embedded processor collects measurements, applies calibration, detects thresholds, and manages alarms. Its 180 MHz processing capability supports responsive control and filtering, and 512 KB flash can retain firmware and calibration coefficients. The package's high pin count supports external sensors and communications, but the exact ADC characteristics, comparator resources, timers, and analog limits are not included in the verified snippets and must be checked in the official data sheet.
Direkomendasikan
Audio and Display Interface
The LPC1822JET100E can support multimedia-control functions requiring more compute and external connectivity than a small low-power MCU. Its 180 MHz ARM Cortex-M3 core can manage user input, display updates, control messaging, and audio-system coordination, while the 512 KB flash stores embedded control firmware. The verified data associates the LPC18xx family with LCD support, but the target's exact LCD interface, external memory interface, audio peripherals, and pin assignments require direct confirmation in the NXP manufacturer documentation.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk LPC1822JET100E — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | LPC1813JET100E | LPC1815JET100E | LPC1823JET100E | LPC1827JET100E | LPC1812JET100E |
|---|---|---|---|---|---|---|
| Package | 100-TFBGA (9 mm x 9 mm) | 100-TFBGA (9 mm x 9 mm) | 100-TFBGA (9 mm x 9 mm) | 100-TFBGA (9 mm x 9 mm) | 100-TFBGA (9 mm x 9 mm) | 100-TFBGA (9 mm x 9 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
Diferensiator Kunci
- Confirmed 180 MHz processing performance (vsLPC1813JET100E)
- Confirmed 512 KB embedded flash configuration (vsLPC1823JET100E)
- Verified single-unit sourcing reference (vsLPC1827JET100E)
Catatan Desain
Use the official NXP 100-TFBGA land pattern rather than deriving a footprint from the 9 mm by 9 mm body size alone. Ball pitch, ball diameter, solder-mask clearance, via-in-pad requirements, and exposed-pad geometry must match the manufacturer drawing. Place the device so high-speed clock, communications, and memory signals follow the datasheet's recommended return paths. Fine-pitch assembly also benefits from inspection points around the perimeter and a controlled assembly process.
Decouple each required supply rail directly at the relevant device pins using the capacitance and placement specified in the NXP data sheet. Separate analog and digital supply paths where supported, provide clean return connections, and avoid routing noisy switching-regulator current through the MCU area. Because the verified data does not state the voltage rails, current limits, or decoupling values, these must not be inferred; check them before schematic release and power-budget calculation.
At the confirmed 180 MHz operating frequency, clock and high-speed interface routing require continuous reference planes and short return paths. Avoid vias in sensitive routes where the device guidance permits, match impedance to the PCB stack-up, and keep switching nodes and inductors away from sensitive inputs. Verify the pin multiplexing and peripheral pin assignment in the official data sheet because the supplied web snippets do not provide the complete 100-ball map.
Do not treat a matching TFBGA package name as proof that two LPC18xx devices are interchangeable. Before substituting LPC1812JET100E, LPC1813JET100E, LPC1815JET100E, LPC1823JET100E, or LPC1827JET100E, compare flash, SRAM, pin multiplexing, peripherals, interrupts, power rails, boot behavior, exposed-pad requirements, and errata. Review the complete data sheets and qualify firmware against the selected part rather than relying on family naming.
Informasi Konformitas
The supplied verified search data does not contain explicit compliance statements for LPC1822JET100E. These fields remain unknown rather than being inferred from the manufacturer or package.
