M2GL060-FGG676 - 56.5K Logic Cells, 387 I/O FPGA | Microchip Technology
MPN: M2GL060-FGG676 ✓ AktifM2GL060-FGG676 Ringkasan
An FPGA is a programmable semiconductor containing configurable logic fabric, memory resources and programmable I/O. Within the product hierarchy, the M2GL060-FGG676 is an FPGA and CPLD, a programmable-logic device, and ultimately a semiconductor. Unlike a fixed-function controller, its internal configuration can be changed to implement different control, data-routing and interface functions on the same board design.
The IGLOO2 architecture combines 56,520 logic cells with 387 I/O and approximately 1,826 kb of RAM as listed for the related M2GL060-FGG676I ordering code. A 1.2 V core supply supports low-voltage digital operation, while the 676-BGA package provides a large, fine-pitch connection interface. The 1 mm terminal pitch and 676 terminals make careful PCB layout, thermal management and assembly planning essential.
The device is suitable for communications, industrial and embedded systems where logic density, I/O availability and programmable functionality are more important than very low unit cost. Common design roles include protocol bridging, legacy interface conversion, peripheral aggregation, system supervision, secure data control and industrial control logic. Its broad I/O count allows multiple external buses and discrete signals to be consolidated into a single programmable device.
Designers should select the appropriate I/O voltage, bank configuration and power architecture from the manufacturer datasheet before layout begins. The BGA footprint requires via-in-pad or via-under-bump design rules, and the power grid should be evaluated for the required logic activity and temperature range. Because the exact public pin table is not reproduced here, use the Microchip IGLOO2 Packaging and Pin Descriptions User Guide when assigning every ball and bank.
This product page combines the manufacturer product resources, distributor listings, cross-reference findings and practical implementation guidance to support device selection. The M2GL060-FGG676 is best suited to designs that require the 676-BGA footprint, 56,520 logic cells and 387 I/Os in a low-power flash-based FPGA.
Alternatif penggantian untuk M2GL060-FGG676 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian M2GL060-FGG676 (sama faktor bentuk dan footprint) — berbeda di dalam Device Type.
M2GL060-FG676
✅ Drop-InKontak untuk harga
Lihat Datasheet →M2GL060-FGG676I
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
M2GL060T-FGG676
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
M2GL060-FGG676 Rating Maksimal & Karakteristik Listrik
| Device Type | IGLOO2 flash-based field-programmable gate array |
| Logic Cells | 56,520 cells |
| User I/O | 387 I/O |
| Paket | 676-BGA |
| Terminal Count | 676 terminals |
| Terminal Pitch | 1 mm |
| Core Supply Voltage | 1.2 V |
| Maximum Supply Voltage | 1.26 V |
| Maximum Operating Temperature | 85 °C |
| RAM | 1,826 kb |
| Programmable Logic | 56,520 logic cells |
| Configuration Memory Type | Flash |
| Tipe Mounting | Surface mount |
| Manufacturer | Microchip Technology |
| Status Lingkungan Hidup | In production |
M2GL060-FGG676 676-bga Diamant Konfigurasi Panduan
Konfigurasi pin untuk M2GL060-FGG676 (676-bga pakai pakai). IC digital ini termasuk GPIO, antarmuka komunikasi (UART, SPI, I2C), dan pin kuasa. Lihat datasheet produsen untuk fungsi pin alternatif dan opsi konfigurasi. Penting untuk desain sistem pengemasan dan PCB.
Tidak ada data diatribut pin yang tersedia untuk M2GL060-FGG676.
Lihat ke: datasheet produk untuk konfigurasi pin penuh.
Aplikasi Umum
M2GL060-FGG676 cocok untuk 6 aplikasis: Industrial Protocol Bridging, Communications Interface Consolidation, System Management and Security Control, Test and Measurement Control, Data Acquisition and Signal Conversion, LED Lighting and Display Control.
Industrial Protocol Bridging
The M2GL060-FGG676 fits industrial protocol-bridging designs that combine several legacy interfaces with a modern control or communications backbone. Its 56,520 logic cells provide substantial parallel logic capacity, while 387 user I/Os support multiple buses, control signals and status inputs in one 676-BGA package. The 1.2 V core supply is suitable for modern low-voltage digital systems, and the 85 °C listed maximum operating temperature supports industrial-temperature equipment. Implement state machines, width conversion, FIFO-based buffering and clock-domain logic in the programmable fabric. Pay close attention to supported I/O standards and bank assignments for each external interface, because the 1.2 V core voltage does not define every I/O operating voltage. A robust industrial design should also plan power sequencing, decoupling and thermal performance for sustained switching activity.
Direkomendasikan
Communications Interface Consolidation
The M2GL060-FGG676 is appropriate for communications equipment that must aggregate parallel data, implement framing logic and support multiple external interfaces. The 387 user I/Os provide flexibility for data buses, clocks, chip selects and supervisory signals, while 56,520 logic cells allow complete packet-format, buffering and routing functions to be implemented without a separate high-performance processor. The 676-BGA footprint reduces the need for multiple large logic devices, although its 1 mm ball pitch demands controlled PCB fabrication and assembly. For communications cards, maintain separation between sensitive clock or data paths and switching power sections, and apply the manufacturer's guidance for unused I/O and configuration pins. Confirm the exact supported I/O standards before assigning legacy or high-speed external interfaces.
Direkomendasikan
System Management and Security Control
The M2GL060-FGG676 can serve as a central system-management FPGA for supervisory logic, secure boot control, key-access sequencing and peripheral enable coordination. Its programmable fabric supports deterministic control paths, watchdog behavior, fault logging and access-control state machines while 387 I/Os leave substantial connectivity for sensors, status LEDs, reset signals and security peripherals. The flash-based IGLOO2 architecture is appropriate for systems requiring configuration persistence and field reprogramming. Designers should partition security-sensitive control logic from general-purpose routing, validate all reset and configuration paths in hardware, and avoid exposing sensitive state through debugging interfaces. The industrial-temperature option is relevant when the controller operates in equipment with an ambient temperature up to the listed 85 °C maximum.
Direkomendasikan
Test and Measurement Control
The M2GL060-FGG676 is well suited to programmable test and measurement front ends that need sequencing, acquisition control, pattern generation and instrument communication in one device. Its 56,520 logic cells allow multiple timing and control channels to be implemented concurrently, while 387 I/Os can connect test points, relays, trigger signals and data-capture logic. The 676-BGA package supports dense routing on a multilayer PCB, and the 1.2 V core operating point fits modern low-voltage instrumentation. For high-accuracy measurements, use the manufacturer's guidance to preserve signal integrity, isolate analog paths from digital switching activity and configure unused banks appropriately. The exact I/O voltage and drive capabilities of each bank must be verified before connecting external test equipment.
Direkomendasikan
Data Acquisition and Signal Conversion
The M2GL060-FGG676 can coordinate data acquisition when a system needs parallel ADC or DAC capture, channel selection, digital filtering and data packing. Its 387 user I/Os offer broad parallel connectivity to converters and sensors, while the programmable logic fabric can implement acquisition state machines, trigger alignment and calibration tables. This makes the device useful for compact industrial or instrumentation systems where a microcontroller alone would lack sufficient I/O or deterministic parallel processing capability. Separate converter clock and data routes from unrelated high-current outputs, use matched-length routing where timing margins are tight, and apply bank-specific voltage constraints. Verify signal-integrity requirements for each interface rather than assuming that all 387 I/Os support the same voltage or performance.
Direkomendasikan
LED Lighting and Display Control
The M2GL060-FGG676 is suitable for sophisticated LED lighting, signage and display-control systems requiring extensive outputs, timing generation and programmable visual effects. The 387 user I/Os can drive multiple channels or serve as serial data and control connections, while 56,520 logic cells support refresh timing, dimming calculations, fault detection and animation sequences. The large 676-BGA package is advantageous where channel density matters and the board can accommodate fine-pitch assembly. Implement current limiting and driver protection in the external power stage, and account for the simultaneous switching load of many channels when planning the FPGA core supply and board heat. Use the manufacturer's I/O guidance to select suitable drive levels and ensure that exposed test or configuration pins are handled according to the required security level.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk M2GL060-FGG676 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | M2GL060-FG676 | M2GL060-FGG676I | M2GL060T-FGG676 |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 676-BGA | 676-BGA - same | 676-BGA - same | 676-BGA - same |
| Logic Cells | 56,520 cells | 56,520 cells | 56,520 cells | 56,520 cells |
| User I/O | 387 I/O | 387 I/O | 387 I/O | 387 I/O |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Terminal Pitch | 1 mm | 1 mm | 1 mm | 1 mm |
| Ordering Difference | Base M2GL060-FGG676 ordering code | Additional 0 in ordering suffix | Industrial-temperature suffix | T packing-code suffix |
Diferensiator Kunci
- Identical dense logic and I/O resources across documented package variants (vsM2GL060-FG676)
- Industrial-temperature ordering option (vsM2GL060-FG676)
- Production status supports design continuity (vsM2GL060-FGG676I)
Catatan Desain
Begin the layout with the Microchip 676-BGA land pattern and pin-assignment guide rather than a generic BGA footprint. The 1 mm ball pitch requires controlled escape routing, typically through multiple PCB layers. Match the recommended pad and via geometry exactly, maintain clearances between adjacent nets, and include the manufacturer's guidance for thermal and electrical via arrays. Any deviation should be checked against assembly capability and signal-integrity simulations.
Plan the 1.2 V core supply for both static demand and switching activity, with the maximum supply constrained to the listed 1.26 V limit. Place decoupling capacitance close to the device's supply and ground balls, preserve a low-impedance return path, and separate sensitive I/O returns from noisy switching outputs. Use the manufacturer electrical tables to determine the exact I/O-bank supply requirements and permitted sequencing conditions.
The 85 °C listed maximum operating temperature limits the ambient and junction design envelope. Estimated board performance depends on package construction, PCB copper area, airflow and FPGA activity, so calculate the junction margin with the actual power dissipation and board thermal model. Use exposed PCB copper and thermal vias where the package design permits, and verify the assembled board at the highest expected ambient temperature.
Informasi Konformitas
The manufacturer lists the M2GL060 family as in production, but exact material-compliance declarations for the M2GL060-FGG676 ordering code were not established. Request current compliance documentation when a formal declaration is required.
