MCIMX31LDVKN5D - i.MX31 ARM1136 MPU 532MHz 457-MAPBGA | NXP
MPN: MCIMX31LDVKN5D ⚠ Waktu Beli TerakhirMCIMX31LDVKN5D Ringkasan
A microprocessor (MPU) is an integrated circuit that contains a complete central processing unit (CPU) core, cache, memory management unit (MMU), and a rich set of peripherals on a single die. The i.MX31 sits in the application processor hierarchy between microcontrollers (MCU) and full SoCs, providing higher computational throughput for multimedia and human-machine interface (HMI) workloads while integrating display, connectivity, and security accelerators at the silicon level. The 'MPU' category bridges traditional MCU-only designs and full SoC platforms, simplifying PCB integration by removing the need for external memory controllers and peripheral hubs.
Key features include the ARM1136JF-S core with Jazelle Java acceleration, an integrated L1 cache, the i.MX31 System Bus (IPU, EMI, SDMA peripherals), support for DDR/DDR2 mobile SDRAM, and a wide range of connectivity peripherals (USB, Ethernet MAC, SD/MMC, I2C, SPI, UART). Operating voltage is 1.22 V to 1.62 V for the core, with 1.71 V to 3.3 V I/O support, making the device suitable for battery-powered and line-powered systems.
The architecture delivers deterministic interrupt latency and integrates an enhanced multimedia accelerator and image processing unit (IPU) for camera and display pipelines, eliminating external companion chips in many HMI designs. The ARM1136 core provides the Thumb-2-like Thumb instruction set and DSP extensions, supporting complex audio and video codecs at modest clock rates. The wide peripheral set reduces BOM cost and PCB area in connected embedded designs.
Typical applications include automotive infotainment head units, industrial HMI panels, patient monitoring and portable medical devices, smart-home gateways, point-of-sale terminals, and consumer multimedia players. The 14x14 mm MAPBGA footprint is compatible with mainstream 4-layer PCB processes and supports both lead-free reflow and RoHS-compliant assembly.
When designing with this device, ensure adequate thermal relief - although the MAPBGA thermal performance is good, sustained compute workloads can push junction temperature near the 85 C industrial limit. Decoupling of all core and I/O rails with 100 nF X7R ceramics placed close to the BGA balls is essential for signal integrity at 532 MHz.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatif penggantian untuk MCIMX31LDVKN5D — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian MCIMX31LDVKN5D (sama faktor bentuk dan footprint) — berbeda di dalam Core Architecture, Mounting Type, Package Type.
MCIMX31DVKN5D
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
MCIMX31CJKN5D
✅ Drop-In✗ Habis Stok
$15.9 / Satuan
Lihat Datasheet →MCIMX31LVKN5D
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
MCIMX31LKN5D
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
MCIMX31VKN5D
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
MCIMX31LDVKN5D Rating Maksimal & Karakteristik Listrik
| Core Architecture | ARM1136JF-S |
| Core Count | 1 |
| Lebar Bus Data | 32-bit |
| Frekuensi Bawah Maximum | 532 MHz |
| Family | i.MX31 |
| Sub-family | i.MX31L (Low Power) |
| Supply Voltage (Core) | 1.22 V to 1.62 V |
| Supply Voltage (I/O) | 1.71 V to 3.3 V |
| Package Type | MAPBGA-457 |
| Package Dimensions | 14 x 14 mm |
| Tipe Mounting | Surface Mount |
| Suhu Kerja | -40 C to +85 C |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Konfigurasi Pin MCIMX31LDVKN5D
| Pin produk A1 | [DATA_NEEDED: pin A1] — Not characterized in available web data |
| Pin produk A2 | [DATA_NEEDED: pin A2] — Not characterized in available web data |
| Pin produk A3 | [DATA_NEEDED: pin A3] — Not characterized in available web data |
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| Pin produk B1 | [DATA_NEEDED: pin B1] — Not characterized in available web data |
| Pin produk B2 | [DATA_NEEDED: pin B2] — Not characterized in available web data |
| Pin produk B3 | [DATA_NEEDED: pin B3] — Not characterized in available web data |
| Pin produk B4 | [DATA_NEEDED: pin B4] — Not characterized in available web data |
| Pin produk B5 | [DATA_NEEDED: pin B5] — Not characterized in available web data |
| Pin produk C1 | [DATA_NEEDED: pin C1] — Not characterized in available web data |
| Pin produk C2 | [DATA_NEEDED: pin C2] — Not characterized in available web data |
| Pin produk C3 | [DATA_NEEDED: pin C3] — Not characterized in available web data |
| Pin produk C4 | [DATA_NEEDED: pin C4] — Not characterized in available web data |
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| Pin produk D1 | [DATA_NEEDED: pin D1] — Not characterized in available web data |
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| Pin produk F4 | [DATA_NEEDED: pin F4] — Not characterized in available web data |
| Pin produk F5 | [DATA_NEEDED: pin F5] — Not characterized in available web data |
| Pin produk G1 | [DATA_NEEDED: pin G1] — Not characterized in available web data |
| Pin produk G2 | [DATA_NEEDED: pin G2] — Not characterized in available web data |
| Pin produk G3 | [DATA_NEEDED: pin G3] — Not characterized in available web data |
| Pin produk G4 | [DATA_NEEDED: pin G4] — Not characterized in available web data |
| Pin produk G5 | [DATA_NEEDED: pin G5] — Not characterized in available web data |
| Pin produk H1 | [DATA_NEEDED: pin H1] — Not characterized in available web data |
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| Pin produk H3 | [DATA_NEEDED: pin H3] — Not characterized in available web data |
| Pin produk H4 | [DATA_NEEDED: pin H4] — Not characterized in available web data |
| Pin produk H5 | [DATA_NEEDED: pin H5] — Not characterized in available web data |
| Pin produk J1 | [DATA_NEEDED: pin J1] — Not characterized in available web data |
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| Pin produk K1 | [DATA_NEEDED: pin K1] — Not characterized in available web data |
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| Pin produk L1 | [DATA_NEEDED: pin L1] — Not characterized in available web data |
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| Pin produk L3 | [DATA_NEEDED: pin L3] — Not characterized in available web data |
| Pin produk L4 | [DATA_NEEDED: pin L4] — Not characterized in available web data |
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| Pin produk M1 | [DATA_NEEDED: pin M1] — Not characterized in available web data |
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| Pin produk N1 | [DATA_NEEDED: pin N1] — Not characterized in available web data |
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| Pin produk N3 | [DATA_NEEDED: pin N3] — Not characterized in available web data |
| Pin produk N4 | [DATA_NEEDED: pin N4] — Not characterized in available web data |
| Pin produk N5 | [DATA_NEEDED: pin N5] — Not characterized in available web data |
| Pin produk P1 | [DATA_NEEDED: pin P1] — Not characterized in available web data |
| Pin produk P2 | [DATA_NEEDED: pin P2] — Not characterized in available web data |
| Pin produk P3 | [DATA_NEEDED: pin P3] — Not characterized in available web data |
| Pin produk P4 | [DATA_NEEDED: pin P4] — Not characterized in available web data |
| Pin produk P5 | [DATA_NEEDED: pin P5] — Not characterized in available web data |
| Pin produk R1 | [DATA_NEEDED: pin R1] — Not characterized in available web data |
| Pin produk R2 | [DATA_NEEDED: pin R2] — Not characterized in available web data |
| Pin produk R3 | [DATA_NEEDED: pin R3] — Not characterized in available web data |
| Pin produk R4 | [DATA_NEEDED: pin R4] — Not characterized in available web data |
| Pin produk R5 | [DATA_NEEDED: pin R5] — Not characterized in available web data |
| Pin produk T1 | [DATA_NEEDED: pin T1] — Not characterized in available web data |
| Pin produk T2 | [DATA_NEEDED: pin T2] — Not characterized in available web data |
| Pin produk T3 | [DATA_NEEDED: pin T3] — Not characterized in available web data |
| Pin produk T4 | [DATA_NEEDED: pin T4] — Not characterized in available web data |
| Pin produk T5 | [DATA_NEEDED: pin T5] — Not characterized in available web data |
| Pin produk U1 | [DATA_NEEDED: pin U1] — Not characterized in available web data |
| Pin produk U2 | [DATA_NEEDED: pin U2] — Not characterized in available web data |
| Pin produk U3 | [DATA_NEEDED: pin U3] — Not characterized in available web data |
| Pin produk U4 | [DATA_NEEDED: pin U4] — Not characterized in available web data |
| Pin produk U5 | [DATA_NEEDED: pin U5] — Not characterized in available web data |
| Pin produk V1 | [DATA_NEEDED: pin V1] — Not characterized in available web data |
| Pin produk V2 | [DATA_NEEDED: pin V2] — Not characterized in available web data |
| Pin produk V3 | [DATA_NEEDED: pin V3] — Not characterized in available web data |
| Pin produk V4 | [DATA_NEEDED: pin V4] — Not characterized in available web data |
| Pin produk V5 | [DATA_NEEDED: pin V5] — Not characterized in available web data |
| Pin produk W1 | [DATA_NEEDED: pin W1] — Not characterized in available web data |
| Pin produk W2 | [DATA_NEEDED: pin W2] — Not characterized in available web data |
| Pin produk W3 | [DATA_NEEDED: pin W3] — Not characterized in available web data |
| Pin produk W4 | [DATA_NEEDED: pin W4] — Not characterized in available web data |
| Pin produk W5 | [DATA_NEEDED: pin W5] — Not characterized in available web data |
| Pin produk Y1 | [DATA_NEEDED: pin Y1] — Not characterized in available web data |
| Pin produk Y2 | [DATA_NEEDED: pin Y2] — Not characterized in available web data |
| Pin produk Y3 | [DATA_NEEDED: pin Y3] — Not characterized in available web data |
| Pin produk Y4 | [DATA_NEEDED: pin Y4] — Not characterized in available web data |
| Pin produk Y5 | [DATA_NEEDED: pin Y5] — Not characterized in available web data |
Aplikasi Umum
MCIMX31LDVKN5D cocok untuk 7 aplikasis: Automotive Infotainment Head Unit, Industrial HMI Touch Panel, Portable Medical Patient Monitor, Point-of-Sale Terminal, Connected Smart-Home Gateway, Multimedia Consumer Player, Test and Measurement Instrumentation.
Automotive Infotainment Head Unit
The MCIMX31LDVKN5D's 532 MHz ARM1136JF-S core and integrated IPU make it well-suited for first- and second-generation automotive infotainment head units. Its native DDR2 controller and display pipeline support WVGA LCD panels at 60 fps without an external graphics chip. The 14x14 mm MAPBGA footprint simplifies four-layer PCB integration, and the -40 C to +85 C industrial temperature range meets cabin thermal requirements. Compared to a discrete MCU + external peripheral hub design, the i.MX31L reduces BOM by approximately 8 to 12 components and supports Linux/WinCE multimedia stacks. Designers should pair the MPU with the NXP PF0100 PMIC and a dedicated CAN transceiver for in-vehicle networking.
Direkomendasikan
Industrial HMI Touch Panel
For industrial human-machine interface panels, the MCIMX31LDVKN5D delivers 532 MHz of compute headroom for Qt/Embedded or Windows CE graphical stacks on 800x480 LCD panels. Its SDMA peripheral offloads data movement from the core, freeing CPU cycles for touch response and PLC comms. The integrated Ethernet MAC supports industrial protocols such as Modbus TCP and EtherNet/IP without an external PHY+MAC chip. Industrial temperature grading and lead-free assembly satisfy most factory automation certifications. For drop-in compatibility, the same 457-MAPBGA footprint allows panel manufacturers to scale between i.MX31L and i.MX31D variants on one PCB layout.
Direkomendasikan
Portable Medical Patient Monitor
Medical patient monitoring and portable diagnostic devices benefit from the MCIMX31LDVKN5D's low active power (i.MX31L sub-family tuning), 32-bit ARM processing for vital-sign DSP, and integrated LCD controller. The wide operating voltage range (1.22 V core, 1.71-3.3 V I/O) simplifies Li-ion battery-powered designs with a single PMIC. The integrated IPU supports direct sensor-to-display pipelines used in ultrasound preview and ECG waveform rendering. NXP's longevity program historically extended i.MX31 availability for medical OEM platforms. Ensure IEC 60601-1 isolation and a medical-grade watchdog timer in the design.
Direkomendasikan
Point-of-Sale Terminal
POS terminals require cryptographic acceleration, display driving, and connectivity in a compact footprint - all natively provided by the MCIMX31LDVKN5D. The i.MX31 security controller (SCC) handles PIN encryption and EMV smart-card flows, while the IPU drives the operator LCD and customer display. The integrated USB host enables printer, barcode scanner, and magnetic-stripe reader peripherals without external hub chips. MAPBGA-457 supports a slim 4-layer PCB layout suitable for countertop terminal enclosures. Designers should add an external secure-key storage IC for PCI PTS certification.
Direkomendasikan
Connected Smart-Home Gateway
Smart-home gateway designs leverage the MCIMX31LDVKN5D's integrated Ethernet MAC, USB host, and SD/MMC for Wi-Fi/ZigBee/Z-Wave dongle aggregation. The 532 MHz ARM1136 core runs embedded Linux comfortably for routing MQTT, Matter, and Thread border-agent services. The DDR2 controller supports up to 1 GB of RAM for in-memory device databases. Industrial temperature grading supports unheated utility-room installations. For drop-in migration to newer gateways, the i.MX6ULL provides pin-compatible upgrade paths on a redesigned PCB.
Direkomendasikan
Multimedia Consumer Player
The MCIMX31LDVKN5D's integrated IPU, SDMA, and ARM1136 DSP extensions accelerate H.263 / MPEG-4 decode for portable media players and set-top boxes. The wide peripheral set (USB, SD/MMC, I2S audio) covers typical media-player IO without external bridges. DDR2 support enables smooth 720p video at moderate bitrates. The 14x14 mm MAPBGA package fits slim consumer enclosures. Note that for newer codec support (H.265), designers should migrate to i.MX6 or i.MX8M families.
Direkomendasikan
Test and Measurement Instrumentation
Portable test and measurement instruments - such as handheld oscilloscopes, logic analyzers, and field-installable cable testers - benefit from the MCIMX31LDVKN5D's deterministic real-time response, USB host/device support, and integrated LCD pipeline. The SDMA controller handles continuous ADC data streams without CPU intervention, freeing the ARM core for user-interface and protocol decode tasks. The wide operating voltage range supports Li-ion battery packs, while the industrial temperature grade enables outdoor field use. The MAPBGA-457 footprint fits compact 4-layer PCBs typical of handheld form factors.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk MCIMX31LDVKN5D — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | MCIMX31DVKN5D | MCIMX31CJKN5D | MCIMX31LVKN5D | MCIMX31LKN5D | MCIMX31VKN5D |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 457-MAPBGA (14x14 mm) | 457-MAPBGA (14x14 mm) - same | 457-MAPBGA (14x14 mm) - same | 457-MAPBGA (14x14 mm) - same | 457-MAPBGA (14x14 mm) - same | 457-MAPBGA (14x14 mm) - same |
| Core | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S |
| Sub-family | i.MX31L (Low Power) | i.MX31D | i.MX31C | i.MX31L | i.MX31L | i.MX31 |
| Core Voltage | 1.22 V to 1.62 V | 1.22 V to 1.62 V | 1.22 V to 1.62 V | 1.22 V to 1.62 V | 1.22 V to 1.62 V | 1.22 V to 1.62 V |
| Lifecycle Status | Last Time Buy | Last Time Buy | Obsolete | Last Time Buy | Last Time Buy | Obsolete |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Diferensiator Kunci
- Lowest active power in i.MX31 family (vsMCIMX31DVKN5D)
- Higher performance density than MCIMX31C (vsMCIMX31CJKN5D)
- Industrial temperature grade (vsMCIMX31VKN5D (commercial))
Catatan Desain
The MCIMX31LDVKN5D requires a multi-rail power architecture: 1.22-1.62 V core, 1.71-3.3 V I/O, and 1.8 V or 2.5 V DDR reference voltages. Use the NXP PF0100 PMIC, which provides hardware-managed power sequencing, DVFS, and sleep-mode retention. Estimated: at 532 MHz and 1.5 V core, active current can exceed 400 mA; budget at least 1.5 A continuous from the buck converter for sustained workloads. Place a 100 nF X7R 0402 decoupling capacitor within 2 mm of every power ball pair.
MAPBGA-457 packages rely on PCB copper and thermal vias for heat dissipation. Design a 4-layer PCB with a continuous inner ground plane under the BGA footprint and a via-array (0.3 mm pitch, 0.2 mm drill) from the BGA thermal balls down to the opposite plane. Estimated: with proper thermal via design, theta_JA falls to 15-20 C/W, keeping junction rise below 20 C at 1 W. Avoid placing the MPU adjacent to high-power inductors; localized heating from magnetics can shift DRAM timing margins.
Route DDR2 signals on the top layer with the i.MX31 on the second layer (via-in-pad recommended for 0.8 mm pitch BGA). Match trace lengths within +/- 50 mil for DDR2 data/byte-group signals and +/- 100 mil for DDR2 address/command/clock. Use 100-ohm differential impedance for the USB differential pair. Keep the 532 MHz clock traces length-matched and isolated from noisy power rails. Reference the NXP i.MX31 hardware design guide for the full layout checklist.
Do not skip boot-mode configuration: the BOOT[3:0] pins determine NAND, SD/MMC, or UART boot source and must be pulled to the correct logic level at reset. Avoid leaving JTAG pins floating - add 10 kohm pull-downs to TCK/TMS/TDI/TRST to prevent spurious boundary-scan events. The reset input requires a clean monotonic edge with proper POR timing - the PF0100 PMIC manages this for you, but discrete reset circuits must include adequate rise time.
Informasi Konformitas
RoHS compliant per NXP product page. Industrial -40 C to +85 C operating range supports automotive cabin and industrial deployments. AEC-Q100 not formally qualified - use newer NXP i.MX8M or i.MX6 Auto parts for AEC-Q100 applications.
